Method and system for monitoring a semiconductor device manufacturing process

ABSTRACT

To realize a method for detecting variations in conditions (drift of the exposure and drift of the focus) in an exposure equipment at a product wafer level in the lithography process, the present invention specifies the process in such a way that calculation results of feature quantities such as electron beam images, line profiles, dimensions, etc. under various sets of the exposure and the focus have been stored as a library, and an electron beam image of the product wafer is compared with these pieces of data in the library so that detection of drifts of the exposure and the focus and check of the results on the screen can easily be performed.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a method for monitoring processes for manufacturing a semiconductor devices, such as a lithography process and an etching process, and a system therefor, and more specifically relates to a method for monitoring a semiconductor device manufacturing process that is suitable to monitor a state of processing in each process from an image obtained by imagining a pattern produced on a substrate that was processed in each treatment process and a system therefor.

[0003] 2. Description of the Related Art

[0004]FIG. 2 is a view showing a flow of the conventional lithography process.

[0005]FIG. 2 is a view showing the flow of the conventional lithography process. The lithography process consists of a photo process in which a resist pattern is formed by exposure and development and an etching process in which the resist pattern is transferred onto a film subject to processing.

[0006] A thin film of a material to be processed has previously been grown on a substrate of a semiconductor wafer. A resist pattern is produced on this thin film by: (a) coating a resist that acts as a photosensitizer to a predetermined thickness; (b) exposing a mask pattern thereto by using an exposure equipment; and (c) developing the resist. The resist pattern thus formed is subjected to (e) dimension measurement by a scanning electron microscope equipped with a measuring function (critical dimension SEM) etc., and if the dimensions fail to satisfy specifications, the resist pattern is peeled off and the pattern is reformed after the exposure was altered. It is often the case that increment/decrement of the exposure is determined by the operator based on his/her experience and intuition.

[0007] Next the resist pattern is transferred by (f) etching the thin film that has been grown below the resist using the resist pattern formed as a mask, to form a circuit pattern. Currently, many of minute patterns of semiconductors are processed by dry etching with the use of plasma. (g) The resist is removed, and subsequently (h) as with the resist pattern, the formed circuit pattern is measured to find its dimensions with the critical dimension SEM etc. In the etching process, since the re-processing of the wafer cannot be executed, if an abnormality is found in the wafer, putting the wafer into the manufacture is stopped, investigation of its cause and possible countervailing measures therefor are performed. If the pattern is normally produced, the film growth process, the photo process, and the etching process are repeated similarly to build up a multilayer circuit.

[0008] In order to achieve an excellent pattern shape through these manufacturing processes, both of the resist pattern formation process and the etching processes must be executed properly. FIG. 3 is for showing one example of the relationship between the resist pattern and the film pattern after etching (source: “Electron Beam Testing Handbook,” Japan Society for the Promotion of Science, the 132nd Committee of “Applications of Charged Particles to Industries,” Research Material No. 98, p. 255). There is a fixed relationship between the shape of the resist pattern and the shape of the film pattern assuming that the etching conditions for the film are the same, and to obtain the film pattern of a predetermined shape, the resist pattern must have a predetermined shape likewise.

[0009] When a new process is going to be set and other occasions, a “condition-finding work” to find the focus and exposure that yield the optimal resist pattern shape is conducted in such a way that as in FIG. 4 a wafer on which a pattern was exposed and developed with the focus and the exposure being varied, respectively, for each shot (one time of an exposure unit) is produced (usually such a wafer is called a “focus exposure matrix (FEM),” and hereinafter referred to as the “FEM wafer”), and the dimensions of the resist pattern of each shot are measured and a finished state is inspected.

[0010] Incidentally, the Japanese Patent Application Laid-open No. H11-288879 discloses a system for supporting the condition-finding work. Through this work, the exposure and focus conditions that allow wider manufacture margins are determined and a product wafer is exposed with these conditions. However, due to diverse process variations (such as variation in photosensitivity of the resist, variation in film thickness of an anti-refection film below the resist, drift in the exposure equipment), among product wafers, found are some wafers each of which has a resist pattern deviating from the predetermined shape under the conditions determined by the condition-finding work. It is the object of the dimension measurement at the step (d) in FIG. 2 that detects these defective wafers. In the prior art, the change in the resist shape caused by the process variations is intended to be compensated by correction of the exposure.

[0011] On the other hand, the processed shape of the pattern that is required to be achieved in the etching process depends on product classes of the device concerned and its processes. For example, in an element isolation process, it is often practiced that a part of the pattern is tapered to improve embedding performance and a corner part thereof is rounded to prevent the electric field from concentrating at the corner part, as shown in FIG. 41(a). Further, in the gate wiring process shown in FIG. 41(b), since the wiring width (gate length) of a gate oxide film part at the bottom of the wiring is important, especially dimensional accuracy at the bottom of the thin film is required. Moreover, naturally these shapes in conformity to the object must be processed uniformly over the whole wafer surface. Because the etching utilizes chemical reactions, equipment and gasses used are different in accordance with a material subject to processing.

[0012] Control of a tilt angle of a side wall of the pattern as shown in FIG. 41(a) is done by the balance between generation of a side-wall protective coat made with a byproduct that is being generated in the processing and the etching; therefore it is largely affected by flow rates of process gasses used, a ratio of these flow rates, their pressures, etc. Besides these parameters, there are etching time, electric power of plasma discharge, bias electric power applied to the sample, wafer temperature, etc. that affect mutually and in a complicated manner, which affect not only the side-wall shape but also the etching rate, a dimensional difference with respect to the resist pattern, a shape of the corner part, etc. Therefore, the processing condition finding at the time when a new product is intended to be manufactured and the like depends on the experience and craftsmanship of experts to a large degree. Moreover, it is difficult to check the shape with high precision and so the shape check is done by cross-sectional observation in most cases.

[0013] Even when processing conditions are fixed by the condition finding, it is often the case where a desired shape cannot be obtained due to drift in property of equipment etc. Especially, regarding process variation resulting from adhesion of byproducts generated during the process onto the interior of a chamber, wear of parts, etc., the countervailing measures are devised by practice of periodical cleaning and replacement of the parts. However, since the process is affected by a lot of parameters as described above, change in the pattern shape caused by these variations cannot be avoided. Detecting the change is a purpose of post-etching dimension measurement of FIG. 2(g). However, among prior arts, there is no effective means of quantitatively evaluating a slope angle, the shape of a corner part, etc. of the pattern as shown in FIG. 5(a) in an invasive manner.

[0014] In the above-mentioned prior arts, there are such problems as described in the following items (1)-(3). (1) There are cases where the shape abnormality of the pattern cannot be detected with dimension values alone. (2) There are cases where the countervailing measure against the shape abnormality of the pattern cannot be devised with the dimension values alone. (3) Information that indicates the process variations quantitatively and that is required to monitor the lithography process and maintain the process stably cannot be obtained.

[0015] Hereafter, how the above-mentioned problems come into being will be described.

[0016]FIG. 5 and FIG. 6 are for showing possible variations of the change in the cross section of the resist pattern. FIG. 5 schematically shows the change in the resist cross section in the case where the exposure of exposure equipment is fixed and the focus is altered. The focus position is moved toward a positive direction for the figures (a), (b), (c), (d), and (e) in this order. Further, FIG. 6 schematically shows the change in the resist cross section in the case where the focus of the exposure equipment is fixed and the exposure is altered. The exposure is increased for the figures (a), (b), (c), (d), and (e) in this order.

[0017] Since it is common that dimension measurement on the critical dimension SEM is performed by using a line profile of a secondary electron image, first a relationship between the cross section and the line profile of the secondary electron intensity will be introduced that is described in “Electron Beam Testing Handbook,” Japan Society for the Promotion of Science, the 132nd Committee of “Applications of Charged Particles to Industries,” Research Material No. 98, p. 261.

[0018] In FIG. 7, A) When the electron beam irradiates the substrate part, the intensity of the detected secondary electron signal indicates a constant value governed by the secondary electron emission efficiency of a substrate material; B) As the beam irradiation point approaches the pattern, the signal strength decreases due to decrease in collection efficiency of the secondary electrons that results from an increase of such secondary electrons as collide against a slope of the pattern among the generated secondary electrons; C) The secondary electron signal strength marks its minimum at a position that is shifted by a half beam diameter from the bottom edge of the pattern toward the outside; D) After passing the point C, the intensity increases abruptly with almost linear dependence because of a change in the secondary electron emission efficiency that corresponds to the change in the slope angle of the sample. E) As the beam irradiation point approaches the vicinity of a top edge, the increase of the signal strength becomes milder because of the difference of collection efficiencies of emission secondary electrons at irradiation points of the slope. F) The secondary electron signal strength marks its maximum at a position that is shifted by a half beam diameter from a top edge of the pattern toward the outside; and G) After passing the point F, the strength gradually decreases and settles to a constant value that is governed by the secondary electron emission efficiency of the pattern material.

[0019] To measure the dimensions from the line profile, it is necessary to detect the edges of the line profile. For an edge detecting technique that is installed on the critical dimension SEM, there are known: a method for detecting a largest slope position as the edge as shown in FIG. 8(a); a method for detecting the edge at a predetermined threshold value as shown in FIG. 8(b); a line approximation method wherein lines are applied to the edge parts and the substrate parts and then intersections of these lines are detected as edges as shown in FIG. 8(c); and the like.

[0020] It is the prior art of FIG. 2 that detects the edges from the line profile of the secondary electron image of the resist pattern having a cross section as of FIG. 5 and FIG. 6 by means of one of the techniques shown in FIG. 8, measures the dimensions, and judges whether the resist cross section is good or bad according to the results. Assuming that the prior art uses the maximum slope method of FIG. 8(a) or the threshold method of FIG. 8(b) with the threshold being set to 50%, the dimensions obtained for (b) to (e) in FIG. 5 hardly differ from one another; therefore the prior art that judges good or bad with dimensional values alone is quite capable of overlooking the change in the shape (→problem (1)).

[0021] Alternatively, assuming that the prior art uses the line approximation method of FIG. 8(c), although the overlooking of the above-mentioned type of variation would not occur because a dimension comparable to a bottom width of the cross section of a trapezoid is obtained, the shape of FIG. 5(b) and the shape of FIG. 6(a), both of which have an almost equal bottom width, cannot be distinguished from each other. If the state of the resist pattern is a situation of FIG. 5(b), the parameter that should be corrected is the focus. However, since in the prior art the exposure is corrected on the basis of the measurement results of dimensions, it is hardly expected that the pattern shape is improved with correction of the exposure (→problem (2)).

[0022] Besides, in order to attain stabilization of the lithography process, it is essential to detect, not a large changes such that measurement results deviate from the standard specification, but a slight change before the variation comes to it, that is, to detect a slight difference between the measurement results and the optimal shape and thereby to sense a sign of the process drift. Then, the results must be used to adjust the exposure conditions for a product to be put into the production line next or to adjust the conditions of the etching process waiting as the next one. However, in the above-mentioned prior art, because the resist cross section cannot be always monitored accurately, such process control is actually difficult to execute (→problem (3)).

[0023] In the passed-over age of large device size (FIG. 9(a)), the effect of the taper of the side-wall upon the post-etching film pattern shape is insignificant. However when the aspect ratio of the pattern (a ratio of the height dimension to the width dimension of the pattern) becomes large (FIG. 9(b) in accompany with the reduction of device size in recent years, the miniaturization reaches a stage where the effect of the taper of the side-wall cannot be ignored. With the prior art that cannot take into consideration the taper of the side-walls, the lithography process is coming to be invalid any longer.

[0024] In the foregoing, an example of the photo process is explained, but also in the etching process occur similar problems. As shown in FIG. 41, since the targeted shape is different according to the pattern, the conventional dimension measurement cannot give necessary shape information. Moreover, since the prior art cannot detect the process abnormality in the photo process accurately, there is a problem that, when there occurs a problem in the post-etching pattern shape, it is hardly possible to judge which process is responsible for the problem, the photo process or etching process.

SUMMARY OF THE INVENTION

[0025] The present invention provides a system for monitoring a semiconductor device manufacturing process that can monitor three dimensional (3-D) shapes of a resist pattern and those of a post-etching circuit pattern and can direct precise alterations of processing condition parameters.

[0026] In other words, the present invention provides a system for monitoring a semiconductor device manufacturing process that will be described in the following constructed on a critical dimension scanning electron microscope (CD-SEM).

[0027] That is, the present invention provides a method for monitoring a semiconductor device manufacturing process that performs the monitoring by the steps of: (a) obtaining an electron beam image of a pattern produced on the surface of a substrate that was subjected to a predetermined treatment process by irradiating the substrate with an electron beam by scanning; (b) calculating feature quantities of this pattern from the electron beam image of the pattern; and (c) monitoring the predetermined treatment process by using i) information of this calculated feature quantities of the pattern and ii) information of the relationship between the processing condition parameters in the predetermined treatment process that have previously been stored and the feature quantities of the pattern produced on the substrate by being subjected to the predetermined treatment process.

[0028] That is, the present invention provides a method for monitoring a semiconductor device manufacturing process that performs the monitoring by the steps of: (a) obtaining an electron beam image of a pattern produced on the surface of a substrate that was subjected to a predetermined treatment process by irradiating the substrate with an electron beam by scanning; (b) calculating feature quantities of the pattern from this electron beam image of the pattern; and (c) judging that at least one variation quantity of the processing condition parameters exceeds allowable errors of the feature quantities of the pattern when at least one feature quantity of the pattern is out of its proper range by using i) information of this calculated feature quantities of the pattern, ii) information of the relationship between the processing parameters in the predetermined treatment process and the feature quantities of the pattern produced on the substrate by being subjected to the predetermined treatment process, and iii) information of the proper ranges of the feature quantities of the pattern produced on the substrate by being subjected to the predetermined treatment process.

[0029] In the system for monitoring a semiconductor device manufacturing process according to the present invention, the CD-SEM has a function of calculating a novel group of feature quantities that express characteristics of the 3-D shape of the resist pattern from the electron beam image (i.e., an image acquired by the CD-SEM).

[0030] The system is devised in such a way that, in the stage of monitoring the photo process, the electron beam image of the resist pattern subject to inspection is acquired, the feature quantities are calculated, the calculated feature quantities are mapped to the reference database that has previously been constructed (a database that describes the relationship between the exposure condition parameters and the group of feature quantities), and thereby the 3-D shape of the resist pattern is evaluated, and at the same time the variation quantities of the exposure condition parameters are calculated.

[0031] Further, in the system for monitoring a semiconductor device manufacturing process according to the present invention, the CD-SEM has a function of calculating a novel group of feature quantities that express the characteristics of the 3-D shape for the post-etching pattern from the electron beam image as well.

[0032] The system is devised in such a way that, in a stage of monitoring the etching process, the electron beam image of the pattern subject to inspection is calculated, the calculated group of feature quantities is mapped to the previously constructed reference database that describes the relationship between the pattern shape and the group of feature quantities, and thereby the 3-D shape of the pattern is evaluated.

[0033] Further, the present invention is devised to provide a user interface that is most suitable to construct the reference database based on the above-mentioned novel group of feature quantities. Moreover, the present invention is devised to provide a method for setting a process window using the above-mentioned reference database. Furthermore, the present invention is devised to provide a method for constructing the reference database using simulation in addition to a method therefor using actual wafers (FEM wafer etc.).

[0034] Further, the present invention is devised to have a function of detecting a tilt image of the secondary electron image and a reflection electron image having a directionality in addition to the secondary electron image of the normal top-down view and be capable of monitoring 3-D shapes more precisely.

[0035] Furthermore, the present invention is devised to provide a function of monitoring the drift of the exposure conditions by storing the variation quantities of the above-mentioned exposure condition parameters for a certain period of time.

[0036] According to the present invention, the 3-D shape of the resist pattern can be monitored at the product wafer level and a the lithography-process monitoring system that can detect not only the drift of the exposure but also the drift of the focus can be provided. As a result, it now becomes possible to detect the abnormality of the 3-D shape caused by the drift of the focus that has been overlooked in the conventional dimension measurement and to prevent defects from being further processed into a post-etching film pattern whose reproduction is basically impossible.

[0037] Furthermore, it becomes possible to achieve precise feedback to the process because a quantitative output can be done, leaving the conventional feedback to the exposure equipment that depends on the experience and the intuition.

[0038] Furthermore, by executing variation predictive control of the exposure conditions, it becomes possible to provide stabler lithography.

[0039] These and other objects, features and advantages of the invention will be apparent from the following more particular description of preferred embodiments of the invention, as illustrated in the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0040]FIG. 1 is a flowchart of the lithography process that has a lithography-process monitoring system according to a first embodiment;

[0041]FIG. 2 is a flowchart showing a prior art lithography process;

[0042]FIG. 3 is a sectional view of the wafer showing the relationship between the resist pattern and the film pattern before and after the etching;

[0043]FIG. 4 is a plan view showing one example of the wafer for condition finding;

[0044]FIG. 5 is a sectional view of the resist showing the change in the resist cross section due to out of focus;

[0045]FIG. 6 is a view showing the change in the resist cross section due to drift of the exposure;

[0046]FIG. 7 is a schematic drawing showing a relationship between the resist cross section and secondary electron signal strength;

[0047] FIGS. 8(a)-8(c) are views explaining a technique for detecting the edge of a line profile;

[0048]FIG. 9(a) is a cross section of a typical shape of the old-time resist pattern; and 9(b) a cross section of a typical shape of the current resist pattern;

[0049]FIG. 10 is a block diagram showing an entire composition of the CD-SEM according to the first embodiment;

[0050]FIG. 11(a) is an SEM image of the line pattern; 11(b) a line profile of the SEM image; 11(c) an enlarged view of the line profile; and 11(d) a schematic diagram of sectional contour form of the line pattern;

[0051]FIG. 12(a) is a matrix chart showing how the CD value varies when the exposure and the focus are altered, respectively; 12(b) a matrix chart showing how the rounding varies when the exposure and the focus are altered, respectively; and 12(c) a matrix chart showing how the footing varies when the exposure and the focus are altered, respectively;

[0052]FIG. 13 is a sequence chart showing a creation procedure of the reference database in the first embodiment;

[0053]FIG. 14(a) is a data sheet showing the data stored in the reference database in the first embodiment; 14(b) a data sheet showing a relationship between the optimal exposure conditions and a set of the exposure and the focus; and 14(c) a data sheet showing the relationships between the upper limit and the lower limit for each of the CD value, the top index-value, and the bottom index-value;

[0054]FIG. 15 is a front view of a display screen showing an example of the process-window setting GUI according to the first embodiment;

[0055]FIG. 16 is front view of the display screen showing an example of a process monitoring GUI according to the first embodiment;

[0056]FIG. 17(a) is a graph showing a relationship between the exposure and the CD value; 17(b) a graph showing a relationship between the focus and the top index with different exposures as a parameter; and 17(c) a graph showing the relationship between the focus and the bottom index with different exposures as a parameter;

[0057]FIG. 18(a) is a graph showing a line profile; and 18(b) and 18(c) are graphs each showing behaviors of DI and DO of the pattern produced under the mutually different exposure conditions;

[0058]FIG. 19(a) is a view showing the line profile; and 19(b) a graph showing relationship of a dimension 1 and a dimension 2 versus a size of b;

[0059]FIG. 20 is a further different sketch of the feature quantity database used in the first embodiment of the present invention;

[0060]FIG. 21(a) is a flowchart showing a procedure of operations of the lithography-process monitoring system according to a second embodiment of the present invention; and 21(b) graphs showing relationships between the lot number and the ΔE and between the lot number and the ΔF;

[0061]FIG. 22(a) is a flowchart showing a operational procedure of the lithography-process monitoring system according to a third embodiment of the present invention; and 22(b) graphs showing relationships between the lot number and the ΔE and between the lot number and the ΔF;

[0062]FIG. 23(a) is a flowchart illustrating the operational procedure of the lithography-process monitoring system; and 23(b) a plan view of the wafer, both of which are for supplementary explanation of the first embodiment of the present invention;

[0063]FIG. 24 is a flowchart illustrating an operational procedure of the lithography-process monitoring system according to a fourth embodiment of the present invention;

[0064]FIG. 25(a) is a view showing the line profile; 25(b) a partial sectional view showing part of sectional contour of the resist pattern; and 25(c) a sectional view showing a sectional contour of the resist pattern;

[0065]FIG. 26(a) is a data sheet of the data stored in the reference database in the fourth embodiment according to the present invention; 25(b) a sectional view showing a sectional contour of the resist pattern; 25(c) a data sheet showing the relationship between the best suited exposure conditions and the exposure or the focus; and 25(d) a data sheet showing a relationship among XL, XR, and an allowable error;

[0066]FIG. 27(a) is a front view of the display screen showing an example of the process-window setting GUI according to the fourth embodiment of the present invention; and 27(b) a matrix 424 to be displayed to supersede a matrix 420 on the display screen;

[0067] FIGS. 28(a), (b) are both schematic drawings of the section of the resist pattern that provide additional information for the method for setting a process window according to the fourth embodiment of the present invention;

[0068]FIG. 29 is a front view of the display screen showing an example of the process monitoring GUI according to the fourth embodiment of the present invention;

[0069]FIG. 30 is a flowchart showing a processing procedure of the lithography-process monitoring system according to a fifth embodiment of the present invention;

[0070]FIG. 31 is a block diagram showing a general construction of the whole CD-SEM according to the fifth embodiment of the present invention;

[0071]FIG. 32(a) is an SEM image of the resist pattern detected with no tilt angle; 32(b) an SEM image of the resist pattern detected with a tilt angle being given; and 32(c) a cross section of the resist pattern to explain an principle of calculating the resist height according to the fifth embodiment of the present invention;

[0072] FIGS. 33(a), (b) are both data sheets of the data stored in the reference database in the fifth embodiment of the present invention;

[0073]FIG. 34 is a flowchart showing a processing procedure of the lithography-process monitoring system according to a sixth embodiment of the present invention;

[0074]FIG. 35 is a flowchart showing a processing procedure of the lithography-process monitoring system according to a seventh embodiment of the present invention;

[0075]FIG. 36 is a block diagram showing a general construction of the overall CD-SEM according to the seventh embodiment of the present invention;

[0076] FIGS. 37(a) and 37(b) are both cross sections of the resist pattern that are for explaining shaded images of the resist pattern;

[0077]FIG. 38 is a flowchart showing a creation procedure of the reference database according to an eighth embodiment of the present invention;

[0078]FIG. 39 is a flowchart showing a processing procedure of the etching-process monitoring system according to the twelfth embodiment of the present invention;

[0079]FIG. 40 shows a lithography process that has the lithography-process monitoring system according to a ninth embodiment of the present invention;

[0080] FIGS. 41(a), 41(b) are views showing shapes of the circuit pattern to be produced by the etching process, wherein 41(a) shows an element isolation process and 41(b) shows a gate process;

[0081]FIG. 42 is a view showing one example of a configuration of a semiconductor production line according to the present invention;

[0082]FIG. 43 is a view illustrating the tilt image according to fifth embodiment of the present invention;

[0083]FIG. 44 is a front view of the display screen showing one example of the process monitoring GUI according to the ninth embodiment of the present invention;

[0084]FIG. 45 is a diagram explaining a method for evaluating in-plane uniformity of post-etching shape according to a tenth embodiment of the present invention;

[0085]FIG. 46 is front view of the display screen showing one example of the process monitoring GUI according to tenth embodiment of the present invention;

[0086]FIG. 47 is a flowchart of the condition-finding work for the etching according to an eleventh embodiment of the present invention;

[0087]FIG. 48 is a view showing the relationship between the etching conditions and the feature quantities defining the pattern shape according to the eleventh embodiment of the present invention;

[0088]FIG. 49 is a diagram for explaining the relationship between the exposure conditions and the etching condition according to a twelfth embodiment of the present invention;

[0089]FIG. 50 is a flowchart for explaining a creation procedure of a reference database that expresses the relationship between the exposure conditions and the etching condition according to the twelfth embodiment of the present invention; and

[0090]FIG. 51 is a figure explaining the wafer according to a thirteenth embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0091] Hereafter, as embodiments of a system for monitoring the semiconductor device manufacturing process according to the present invention, a case where it is applied to the lithography process and a case where it is applied to the etching process are described concretely referring to the figures.

First Embodiment

[0092] (1-0) Fundamental Form of Photo Process

[0093]FIG. 1 is a conceptual diagram of the lithography process, according to the first embodiment of the present invention, that has a lithography-process monitoring system constructed on a CD-SEM 200 (the outline composition is shown in FIG. 10). In this embodiment, CD-SEM obtains the electron beam image (step 2001), subsequently calculates a group of feature quantities (details will be described later) that represent characteristics of a 3-D shape of the resist pattern from the electron beam image (step 2002), evaluates the 3-D shape based on the group of feature quantities, and at the same time calculates feedback quantities ΔE and ΔF to the exposure condition parameters (the exposure and the focus) by using a reference database 301 (details will be described later) that has previously been constructed using the FEM wafer (step 2003-2005).

[0094]FIG. 42 shows an example of composition of the semiconductor production line that includes the lithography-process monitoring system according to the present invention. Pieces of manufacturing equipment are connected to an equipment control system 500 via the network, and the equipment control system 500 controls information of the manufacturing conditions etc. of processes for each kind product in addition to the operating state and maintenance status of these pieces of equipment.

[0095] Further, measuring instruments such as a film thickness measuring apparatus 506 and the CD-SEM 200 are connected to a QC data collection and analysis system 501, which collects and controls the measurement results of the film thickness and the dimension measurement. Further, this QC data collection and analysis system 501 is connected to an abnormality monitoring system 502, and when an abnormality occurs in the dimension measurement result, it will be reported to a production line manager 505 through the display and communication means 503.

[0096] Moreover, information about when and which wafer starts to undergo which process with which equipment is managed by the commencement-of-operation history management system 504. Therefore, if the need arises, processing history for all wafers can be referred to.

[0097]FIG. 10 is a block diagram showing the composition of the CD-SEM 200 that is used in this lithography-process monitoring system. In FIG. 10, a primary electron beam 202 emitted from an electron gun 201 passes through a beam deflector 204, an ExB deflector 205, and an object lens 206 to irradiate a wafer 100 placed on a stage 101, being in focus.

[0098] When the wafer 100 is irradiated with the electron beam, secondary electrons are generated from the wafer 100. The secondary electrons generated by the sample 100 are deflected by the ExB deflector 205, and detected by a secondary electron detector 207. A two-dimensional electron beam image can be obtained by detecting the electrons generated from the sample in synchronization either with two dimensional scanning of the electron beam by the deflector 204 or with repetitive scanning of the electron beam by the deflector 204 in an X direction together with continuos movement of the wafer by the stage 101 in a Y direction.

[0099] A signal detected by the secondary electron detector 207 is converted to a digital signal by an A/D converter 208, which is sent to an image processing part 300. The image processing part 300 has image memory for temporarily storing digital images and a CPU for calculating the line profile and the feature quantities from the image in the image memory. Further, the image processing part 300 has a storage medium 301 for storing the detected images and line profiles, calculated feature quantities, etc. in a reference database. A display device 302 is connected with the image processing part 300, so that the operator is allowed to conduct necessary operation of the equipment, confirmation of the detected results, etc. with the help of a graphical user interface (hereinafter referred to as the “GUI”).

[0100] First, a calculation procedure for the feature quantities that is performed in the image processing part 300 is shown in FIG. 11. For a start, to improve the S/N, N lines of the acquired image (FIG. 10(a)) are superposed to form a smooth line profile (FIG. 11(b)). The line profile has peaks at positions corresponding to the edges of the resist pattern. Taking the left-side peak as an example for the explanation, the peak portion is divided into the left side and the right side by a straight line L1 passing the maximum as in FIG. 11(c), and an average DO of the light-side widths DO(j) and an average DI of the right-side widths DI(j) are calculated.

[0101] As shown in FIG. 11(d), since the above-mentioned maximum point roughly corresponds to a maximum slope point Pb of the resist pattern edge, it can be said that the value DO represents a measure of the average slope angle for a portion thereof below the maximum slope point, namely a bottom-side portion, and the value DI indicates a measure of the average slope angle for a portion thereof above the maximum slope point, namely a top-side portion.

[0102] Hereinafter, DO is called the bottom index-value and DI is called the top index-value. Three feature quantities consisting of the top index-value and the bottom index-value plus the dimension value CD calculated by a method of FIG. 8 etc. serve as a group of feature quantities that represent the characteristics of the 3-D shape of the resist pattern.

[0103]FIG. 12 shows one example of how the above-mentioned three feature quantities vary due to variations of the exposure and the focus. In general, the CD value (line width etc.) changes in accordance with the exposure, but a change in the CD value caused by the focus variation is small and how it changes is as illustrated in FIG. 12(a). On the other hand, the top index-value and the bottom index-value change depending on the focus rather than the exposure as in FIGS. 12(b), (c), respectively.

[0104] Generally, when the focus varies to the positive side, the rounding occurs at the top part and hence the top index-value becomes large; when the focus varies to the negative side, the footing occurs in the bottom part and hence the bottom index-value becomes large. Three indices explained in the foregoing are the group of feature quantities to be calculated at the step 2002 in FIG. 1.

[0105] Next, the reference database 301 will be described. In this embodiment, prior to putting the product wafer into the process, the reference database has been created using the FEM wafer shown in FIG. 4. FIG. 13 shows a flowchart for creation of the reference database using the FEM wafer. The flow includes the steps of: first, specifying the recipe; loading and aligning the wafer; subsequently, moving the wafer to a test point; adjusting the focus and searching the pattern by means of temperate matching, setting the test point in the field of observation and acquiring the image; and calculating the feature quantities from the image data at the test point and storing them.

[0106] This procedure is performed for all test points. The feature quantities thus obtained are stored so as to be paired with the data of the exposure and the focus (FIG. 14(a)). Next, by using this database, the optimal exposure conditions are obtained and at the same time the tolerances for the three index-values are determined.

[0107]FIG. 15 shows one example of a GUI screen used to determine the optimal exposure conditions. In an insert 401 a, the CD values are displayed for different exposures and different foci by referring to information of FIG. 14(a). Displayed contest is any one of (1) readings of the CD values, (2) color-coded representation of the CD values according to the magnitude, (3) color-coded representation of the CD values designating an in-proper range and an out-of-proper range that are set by a bar 401 b for setting a proper range.

[0108] Regarding the top index-value DI and the bottom index-value DO, the same representations are done at inserts 402 and 403, respectively. In an insert 404, a product set 405 of the proper ranges for the CD value, the top index-value DI, and the bottom index-value DO is displayed. This product set becomes the so-called process window. The user can determine the process window by setting the proper ranges of the feature quantities with the help of the bars 401 b, 402 b, and 403 b, and besides can determine the proper ranges of the feature quantities by setting the process window on the insert 404 conversely.

[0109] A center value (E0, F0) located in the middle of the process window is the optimal exposure conditions, which is displayed in a table 406 and also is stored in the reference database (FIG. 14(b)). Moreover, it will become the exposure conditions of the product wafer coming thereafter. The determined proper ranges for three feature quantities are displayed in a table 407 and also are stored in the reference database (FIG. 14(c)).

[0110] Next, the steps 2003-2005 in FIG. 1 will be described.

[0111] At the step 2003, three feature quantities (i.e., the CD value, the top index, and the bottom index) calculated from the electron beam image of the product wafer subject to inspection are compared with the information of FIG. 14(c), and if all three quantities satisfy the conditions, the lithography process is assumed to be normal. If any one of the three quantities is out of the pertinent condition, the flow proceeds to steps 2004, 2005, where the three feature quantities are compared with the information of FIG. 14(a) and an index i designating a set of feature quantities that best agree with the calculated feature quantities is obtained. Now it is understood that differences ΔE and ΔF between a set of the exposure E(i) and the focus F(i) designated by the index i and a set of the optimal exposure E0 and the optimal focus F0 (ΔE=E(i)−E0, ΔF=F(i) F0) are the deviations of the exposure conditions of the resist pattern subject to inspection from the proper ranges. The values ΔE and ΔF are fed back to the exposure equipment to correct the exposure conditions thereafter (step 2006 in FIG. 1).

[0112]FIG. 16 is a schematic drawing of the GUI screen on which the user confirms the variation situation of the exposure conditions. An insert 410 displays how each of the three feature quantities deviates from its proper range, respectively. In an insert 411, the deviations ΔE, ΔF from the optimal exposure conditions are displayed being superposed over the process window, so that the user can confirm on the screen how much margins the exposure and the focus have, respectively. Note that, in FIG. 1, the exposure conditions are assumed to be automatically corrected based on information of the calculated variation quantities ΔE and ΔF. However, it goes without saying that the operator may alter the exposure conditions in accordance with the corrections of the exposure conditions displayed on the screen as shown in FIG. 16.

[0113] Moreover, in the system of FIG. 1, the acquisition of the electron beam image through quality judgement of the pattern shape plus the calculation of the corrections of the exposure conditions are performed in the CD-SEM 200. However, the following scheme may be adopted: in the production line of FIG. 42, only acquisition of the image is performed by the CD-SEM 200, and remaining part of processing is executed by the QC data collection and analysis system 501 and the equipment control system 500 or using other computer connected with these systems through a communication network. The alteration of the exposure conditions may be automatically executed by the equipment control system 500, or may be directed by a human operator who confirms the results through the display and communication means 503.

[0114] According to this embodiment No. (1-0), first it becomes possible to detect the shape abnormality of the resist pattern such as the rounding and the footing, which has been impossible to detect conventionally with the CD values alone, by virtue of introduction of the top index and bottom index in addition to the conventional CD value. Consequently, this embodiment can prevent the shape abnormality of the post-etching film pattern resulted from the abnormality of the resist pattern shape. Further, there is also an advantage that not only the existence of the abnormality but also portion where the shape abnormality occurs can be found concretely, for example, whether or not the rounding occurs and whether or not the footing occurs.

[0115] Second, since not only the shape abnormality can be detected but also variations of the exposure and the focus that are main factors therefor can be grasped quantitatively, more accurate process feedback becomes possible. Especially, since the focal depth of the exposure tends to become shallower as the pattern rule reduces, knowledge of variation quantity of the focus provide a large effect.

[0116] Third point, a work to determine the optimal exposure conditions becomes easy and of high precision in various respects. Taking one example, since the states of the size, the rounding, and the footing are expressed numerically, the optimal conditions can be determined without relying on guesswork. Moreover, also in the case where the wafer is cut to examine the cross section or where the wafer is processed by means of FIB to observe the cross section, only a few points on the FEM need to be observed and the cross sections at other points can be predicted from the feature quantities; therefore a large amount of time required to observe the cross sections can be saved. Possibly, there is an advantage that the setting of the proper ranges is easy for the operator to understand because each feature quantity is one that is linked with the cross section.

[0117] Fourth, since a time required for a series of operations (the steps 2001-2005 in FIG. 1) is little more than that at a step in which the dimension measurement is performed using the CD-SEM in the conventional lithography process ((d) of FIG. 2), it is also good that the process does not sacrifice the throughput despite of having a number of advantages as described above.

[0118] Note that in the lithography process that uses plural pieces of exposure equipment, since each piece of the exposure equipment has a difference to other ones, it is preferable that the reference database has been created for each piece of the exposure equipment. Further, here explanation is made taking the line pattern as an example, but it is feasible to apply this embodiment to other patterns such as a circular pattern by modifying the method for fabricating the line profile.

[0119] Furthermore, until here no mention was made of image acquisition points on the wafer subject to inspection. It is preferable in actual operation that, as shown in FIG. 23, images are acquired at predetermined points on the wafer (for example, points designated with a symbol X in FIG. 23(b)) and the feedback quantities ΔE and ΔF of the exposure conditions are determined by judging the feature quantities obtained from those images from a comprehensive standpoint.

[0120] In this case, a distribution of the feature quantities in the wafer can be found by grouping positions designated with the symbol X in FIG. 23(b) to, for example, four regions (groups) consisting of upper, lower, right, and left regions and further either (a) by adding up the feature quantities of the images at the positions designated with the symbol X in each region to derive a set of feature quantities; or (b) by synthesizing the line profile for each region by addition of the line profiles at the positions designated with the symbol X in each region and then obtaining the feature quantities from the synthetic line profile of the region concerned; so that the feedback quantities ΔE and ΔF of the exposure conditions can be set for each region of the wafer.

[0121] Moreover, it becomes possible to obtain a distribution of the feature quantities in a unit exposure region (more specifically, in the exposure of the step and repeat method, a region corresponding to one shot of exposure; in the scanning exposure method wherein the wafer and the mask are relatively moved successively, one scan region) at the time of the exposure, in the same manner as described above, and further the exposure conditions can be adjusted according to this distribution in the unit exposure region. Here, the adjustment of the exposure conditions includes not only adjusting the exposure and the exposure time but also adjustment by modification of conditions of an exposure mask (size of the mask pattern, amount of distortion of the mask, etc.) for the adjustment.

[0122] (1-1) Variant 1

[0123] In the above-mentioned embodiment No. (1-0), the actual values of feature quantities, as shown in FIG. 14(a), that are correlated to the exposure and the focus are stored in the reference database. Alternatively, there may be adopted a method whereby the relationships between the exposure conditions and the feature quantities are described in the forms of functions and these functions are stored in the reference database. In the stage of creating the reference database, first the feature quantities are calculated from the electron beam image for all points on the FEM, and then the relationships between the feature quantities and the exposure and between the feature quantities and the focus are approximated with suitable functions capable of expressing the relationships (for example, the data are applied to the polynomial expressions representing the relationships). A concrete example will be shown below.

[0124]FIG. 17(a) shows the relationship between the CD value and the exposure. Since the CD value varies in almost proportional to the exposure (not depending on the focus), a linear expression of E is applied to the CD value and an expression CD=f(E) is obtained. FIG. 17(b) shows the relationship between the focus and the top index for several different exposures. Since the top index-value hardly changes when the focus shifts into a negative region, fitting is considered only for a region F>0 and an expression of F, for example, a quadratic expression of F is fitted to the data to obtain TOP(E1)=g1(F), TOP(E2)=g2(F) . . . FIG. 17(c) shows the relationship between the focus and the bottom index for several different exposures. Since the bottom index-value hardly changes when the focus shifts into a positive region, fitting is considered only for a region F<0 and an expression of F, for example, a quadratic expression of F is fitted to the data to obtain BOT(E1)=h1(F), BOT(E2)=h2(F) . . . . In the reference database, f(E), TOP(E1), TOP(E2) . . . , BOT(E1), BOT(E2) . . . are stored.

[0125] At the step 2004 in FIG. 1, first the CD value is substituted into the function CD=f(E) to obtain the exposure Ex, and then the exposure Ex is substituted into the function gx(F) that expresses the relationship between the focus and the top index TOP and also is substituted into the function hx(F) that represents the relationship between focus and the bottom index BOT to find the focus Fx. The differences between these values and a set of the optimal exposure E0 and the optimal focus F0, ΔE and ΔF (ΔE=Ex−E0, ΔF=Fx−F0) are considered to be the deviations of the resist pattern subject to inspection from the proper ranges of the exposure conditions for the resist pattern.

[0126] According to this embodiment No. (1-1), there is an advantage that the reference database can be reduced in its scale in addition to the effects of the embodiment No. (1-0) described in the foregoing. Utilizing this advantage, the exposure equipment and a developing machine may have respective functions. Further, since the exposure conditions Ex and Fx are simply calculated as described above, there is an advantage that the processing time can be lessened markedly.

[0127] Note that, here, the relationship between the CD value and the exposure is described in a linear expression and relationships between the top index and the focus and between the bottom index and the focus are described in quadratic expressions, respectively. However, these are merely one example and it is preferable to adopt functions that match the situation of the subject to inspection.

[0128] (1-2) Variant 2

[0129] In the above-mentioned embodiment No. (1-0), used are the average value DO of the left side widths DO(j) and the average value DI of the right side widths DI(j) that are defined when the peak portion is divided into the left-side and the right-side sub-portions with a straight line L1. However, DO(j) and DI(j) as they are may be used. In FIG. 18, setting a value of the maximum point to 100% and setting right-side and left-side minimum values to 0% when the profile is divided into the right-side and the left-side sub-portion, DO(j) and DI(j) are calculated at every 5% of the profile from 10% to 90%. Therefore, a total of 35 points consisting of 17 DO(j), 17 DI(j), and additionally the CD value are used as the feature quantities. FIG. 18(b) and FIG. 18(c) shows examples of behaviors of DO(j) and DI(j) obtained under mutually different exposure conditions, respectively.

[0130] At the steps 2004-2005 in FIG. 1, the feature quantities of the product wafer are compared with plural sets of feature quantities stored in the reference database and an index i designating a set of the feature quantities that best agree with the said feature quantities (hereinafter referred to as “best agreed index i”) is obtained. For example, denoting the feature quantities of the product wafer as I (I is a vector having 35 feature quantities as elements), the feature quantities for each set of exposure conditions in the reference database as R(i) (R(i) is a vector having 35 feature quantities as elements with i: index of the exposure conditions), all what should be done by the method is only to find an index for representing the exposure conditions that minimize (R(i)−I)².

[0131] According to this embodiment No. (1-1), although a processing time that is necessary to obtain the best agreed index i for the feature quantities increases only so long as the number of the feature quantities is larger than the embodiment No. (1-0), there is an advantage that certainty of calculating the index i increases. Note that cutting the profile at every 5% is an example and it is also possible to increase or decrease the points. Alternatively, the dimension 1 and the dimension 2 shown in FIG. 19 may be used instead of DO(j) and DI(j) in FIG. 18.

[0132] (1-3) Variant 3

[0133] As further different feature quantities, the acquired electron beam image as it is or the line profile can be used. At a stage in which the reference database is created, the acquired image and line profile are stored being in a set together with the exposure conditions (FIG. 20). First, a case where the electron beam image, as its is, is used will be described. The electron beam image of the product wafer subject to inspection is denoted by I(x, y), the electron beam image under the optimal exposure conditions stored in the reference database by R0(x, y), and the electron beam image of the exposure condition number i by Ri(x, y). Here, (x, y) is coordinates in the image.

[0134] At the step 2003 in FIG. 1, a correlation value (normalized correlation) between the I(x, y) and the R0(x, y) is obtained, and if the correlation value is less than a previously determined threshold value, the flow proceeds to the step 2004, 2005. At the steps 2004, 2005, the correlation value between I(x, y) and Ri(x, y) (i=1, 2, 3 . . . ) is obtained one by one and the exposure condition number i that gives the highest correlation value is found. Representing the exposure and the focus at the exposure condition number i by E and F, respectively, the differences ΔE and ΔF (ΔE=Ex−E0, ΔF=Fx−F0) between a set of these values and a set of the optimal exposure E0 and the optimal focus F0 are the deviations of the exposure conditions of the resist pattern subject to inspection from the proper ranges.

[0135] When the line profile is used, the procedure is exactly the same. The electron beam image of the product wafer subject to inspection is denoted by I(x), the electron beam image under the optimal exposure conditions stored in the reference database by R0(x), and the image at the exposure condition number i by Ri(x). Here, x is a coordinate of the line profile. At the step 2003 in FIG. 1, the correlation value between I(x) and R0(x) (normalized correlation) is obtained, and if the correlation value is less than the previously determined threshold, the wafer proceeds to the steps 2004, 2005. At the steps 2004, 2005, the correlation value between I(x) and Ri(x) (i=1, 2, 3, . . . ) is obtained one by one, and the exposure condition number i with the highest correlation value is found. Representing the exposure and the focus at the exposure condition number i by E and F, respectively, the differences ΔE and ΔF (ΔE=Ex−E0, ΔF=Fx−F0) between a set of these values and a set of the optimal exposure E0 and the optimal focus F0 are the deviations of the exposure conditions of the resist pattern subject to inspection from the proper ranges.

[0136] When the actual electron beam image is used in this embodiment No. (1-3), although there is a disadvantage that a scale of reference database becomes larger, on the other hand there is an advantage that the method can be applied to every patterns. In general, since the electron beam image has a low S/N, in order to obtain the line profile suitable for the processing, it is absolutely necessary to perform line addition as shown in FIG. 11. It is only the line pattern that simple line addition can be done and other patterns need some devise in performing the line addition (e.g., in the case of a circular pattern, plural cross sections along different diameters are added, etc.), so that it is difficult to apply this method to every patterns. If the actual electron beam image is used, there is no constraint about the pattern configuration. A scheme may be adopted whereby the embodiments described in the foregoing are used properly according to the pattern configuration.

Second Embodiment

[0137]FIG. 21 shows a processing sequence in the lithography-process monitoring system constructed on the CD-SEM 200, according to the second embodiment of the present invention.

[0138] In FIG. 21, the steps 2001-2005 in which calculation of ΔE and ΔF is fully achieved are the same as in the first embodiment. Subsequently, ΔE and ΔF, as they are, are not fed back to the exposure equipment, but the feedback quantities ΔE1 and ΔF1 are determined by referring to a history database 303 and using the information of past ΔE and ΔF. For example, in the history database 303, ΔE and ΔF for a few lots in the past are stored, and definitive feedback quantities ΔE1 and ΔF1 are determined by approximating the history data with a straight line as shown in FIG. 21(b).

[0139] Even under the same exposure and the same focus, completely identical resist pattern is not necessarily produced when observing it microscopically, and in addition ΔE and ΔF that were calculated from each subject to inspection may have a certain error because of a slight difference in picture taking condition of the CD-SEM, calculation error of the feature quantities, etc. Since it is not that the focus varies abruptly but that it varies in a drifting manner, this embodiment can execute stabler process control compared to a case where the results of a single calculation is used to determine the feedback quantity.

[0140] Incidentally, in FIG. 21 the history database is assumed to exist on the CD-SEM. However, it goes without saying that it is not necessary for the database to be on the CD-SEM and that it may be on other storage device on the network, as shown in FIG. 42. Further, in the figure, data of a few lots in the past are assumed to be the history data and are used, but data of a few lots are merely an example and the history data is not limited to this.

Third Embodiment

[0141]FIG. 22 shows a processing sequence of the lithography-process monitoring system constructed on the CD-SEM 200, according to the third embodiment of the present invention.

[0142] In the first and the second embodiment, only when the group of feature quantities do not satisfy the conditions at the step 2003, the routine of calculating ΔE and ΔF is performed. However, in this embodiment, even when the group of feature quantities of the subject to inspection satisfy the conditions, referring to the history database 303 and based on the trends of variations of ΔE and ΔF from the past, the situations in the future are predicted and, if necessary, fine tuning of the exposure conditions (Δe, Δf) is executed.

[0143] In FIG. 22(b), consider a range bordering the alternate long and short dash lines as a process window. The exposure is thought to be on an upward trend and in the next run the exposure is at a risk of going out of the process window. On the other hand, the focus is thought to be on a downward trend. In this case, the subject to inspection in this run is made to proceed to the next process as it is, but in future runs thereafter, the exposure conditions is adjusted by the amounts of Δe and Δf.

[0144] According to this embodiment, when an indication that the exposure conditions are going out of the standard range is detected, the exposure conditions can be adjusted in an advanced control manner as described above; therefore the number of wafers that need to be subjected to the re-exposure process can be decreased. Further, since, as the deviations from the standard ranges become larger, it becomes difficult to estimate the adjustment quantities of the exposure conditions with high precision; also in that sense, the effect associated with constant controlling of the deviations not to become too large is large. Incidentally, in FIG. 22, the history data is assumed to be on the CD-SEM. However, it goes without saying that it is not necessarily on the CD-SEM and that the database may be on other storage device on the network, as shown in FIG. 42. Further, in the figure, data of a few lots in the past are used as the history data, but data of a few lots are merely an example and the history data is not limited to this.

Fourth Embodiment

[0145]FIG. 24 is a conceptual diagram of the lithography process that has the lithography-process monitoring system constructed on the CD-SEM 200, according to the fourth embodiment of the present invention. In this embodiment, the CD-SEM obtains the electron beam image (step 2001), subsequently predict the cross section of the resist pattern from the electron beam image (details will be described later) (step 2020), evaluates the 3-D shape based on the predicted cross section, and at the same time calculates the feedback quantities ΔE and ΔF to the exposure condition parameters (the exposure and the focus) by using the reference database 301 (details will be described later) that has previously been constructed using the FEM wafer (steps 2022-2023).

[0146] To begin with, referring to FIG. 25, a method for predicting the cross section of the resist pattern will be described. FIG. 25(a) is the line profile obtained by superposing N lines as with the first embodiment (refer to FIG. 11(a)). Representing the signal strength at a position k by SE(k), a local slope angle at the position k by θ(k), since the secondary electron signal strength is proportional to 1/cos θ(k), the relationship between SE(k) and θ(k) can be expressed as an expression (25-1).

expression

[0147] Here a is a proportional constant and b is an offset.

[0148] On the other hand, since the interval L in FIG. 25(a) corresponds to the edge of the resist pattern, representing the resist height by H, the pixel size by d, integration of d×tan θ(k) for the interval L yields H, as shown in an expression (25-2). Here, if a suitable value is given H and the slope angle at the resist top is assumed to be “0,” values a and b can be obtained by the method of least square. Substitution of the obtained a and b into the expression (25-1) yields the slope angle θ(k) at a position k, which indicates how the slope angle varies at the edge, and a pseudo cross section as of FIG. 25(c) can be obtained.

[0149] Since the resist height H is unknown and practically the relationship between SE(k) and θ(k) is not a simple relationship as the expression (25-1) described in FIG. 25, the pseudo cross section obtained in the above-mentioned manner does not agree with the actual cross section. However, when the variations of the exposure conditions cause the resist cross section to change, the pseudo cross section exhibits a variation that reflects them; therefore the pseudo cross section can be treated as with the group of feature quantities in the first embodiment.

[0150] Next, the reference database 301 will be described. In this embodiment, prior to putting the product wafer into the manufacturing process, the reference database has been created using the FEM wafer shown in FIG. 4. A creation procedure is the same as the first embodiment, but instead of calculating the group of feature quantities, the pseudo cross section is calculated and stored so as to be paired with the exposure and the focus. The calculated results of the pseudo cross section may be stored as they are in the form of a series, or the pseudo cross section may be represented by a suitable function and the function may be stored instead. FIG. 26(a) exhibits a case where the results are stored as edge positions on the right side and the left side at the height levels of 10%, 20%, . . . 90%. For example, XL(90) denotes a position on the left edge at a height level of 90%, as shown in FIG. 26(b). In the reference database, as with the first embodiment, pseudo cross sections under the optimal exposure conditions (FIG. 26(c)) and under the optimal exposure conditions (FIG. 26(d)) are stored in addition to the information of FIG. 26(a).

[0151]FIG. 27 shows an example of the GUI screen that is used to determine the optimal exposure conditions. When the user designates a suitable area in the matrix 420 that is composed of a horizontal axis representing the exposure and the a vertical axis representing the focus, for example, an area 421, the pseudo cross section under the exposure conditions corresponding to the area previously selected is displayed as in an insert 422. As shown in an insert 423, when conditions for the pseudo cross section are set in the form of the tolerances of the resist widths for the upper portion, the middle portion, and the lower portion, the information of FIG. 26(a) that is stored in the reference database is referred to and a matrix that specifies the ranges of the exposure and the focus both of which satisfy the conditions is displayed as of the matrix 424, taking the place of the matrix 420. For conditions affecting the pseudo cross section, a ratio of the top-side width and the bottom-side width of the resist pattern shown in FIG. 28(a), or a ratio of the left-side and the right-side edge width as shown in FIG. 28(b) may be included in the process window. The center values (E0, F0) are the optimal exposure conditions, which is displayed on the screen and at the same time is stored in the reference database as the exposure conditions for the product wafer coming thereafter.

[0152] Next, the steps 2021-2023 in FIG. 24 will be described.

[0153] At the step 2021, the pseudo cross section calculated from the electron beam image of the product wafer subject to inspection is compared with the information of FIG. 26(d), and if the pseudo cross section is within the tolerances, the lithography process is assumed to be normal. If the shape is out of the tolerances, the flow proceeds to the steps 2022, 2023, where the pseudo cross section is compared with the information of FIG. 26(a) to find the best agreed index i for the pseudo cross section. Now, the differences ΔE, ΔE between a set of the exposure E(i) and the focus F(i) at the index i and a set of the optimal exposure E0 and the optimal focus F0 (ΔE=E(i)−E0, ΔF=F(i)−F0) are considered to be the deviations from the optimal ranges of the exposure conditions for a resist pattern subject to inspection. ΔE and ΔF are fed back to the exposure equipment to correct the exposure conditions thereafter (step 2006).

[0154]FIG. 29 is a schematic diagram of the GUI screen on which the user confirms the fluctuation state of the exposure conditions. In an insert 430, the pseudo cross section calculated from the line profile of the electron beam image of a sample subject to inspection and the pseudo cross section calculated from the line profile of the electron beam image under the optimal exposure conditions are displayed being superposed, one on the other. How much the former deviates from the latter is displayed. In an insert 431, the deviations ΔE and ΔF from the optimal exposure conditions are displayed being superposed on the display window.

[0155] This embodiment has an advantage that it is easy for the user to handle the parameters and to adjust the process compared to the case where the feature quantities that are relative values and absolute numbers are used because the user can set the conditions by using values linking to real values especially when determining the optimal exposure conditions after obtaining the process window, in addition to the same affect as described in the embodiment No. (1-0).

[0156] Note that the relation equation between the signal strength SE(k) and the slope angle θ(k) that is used in obtaining the pseudo cross section is not necessarily limited to the expression (25-1) and that a function fitted to the relationship between the signal strength and the slope angle that has previously been investigated may be used. Further, it goes without saying that this embodiment can be combined with the second and the third embodiments.

Fifth Embodiment

[0157]FIG. 30 is a conceptual diagram of the lithography process that has the lithography-process monitoring system constructed on the CD-SEM 200, according to the fifth embodiment of the present invention. The CD-SEM used in this embodiment has a tilting stage 102 that can move in the xy plane and further is equipped with a tilting function as shown in FIG. 31, whereby the tilt image can be obtained besides the top-down view etc.

[0158] In this embodiment, the CD-SEM obtains a normal top-down view image and the tilt image (step 2031); subsequently calculates the height of the resist pattern from the normal image and the tilt image by a method that will be described later (step 2032); further calculates the group of feature quantities that represent features of the 3-D shape of the resist pattern (step 2033); and evaluates the 3-D shape based on the predicted cross section and at the same time calculates the feedback quantities ΔE and ΔF to the exposure condition parameters (the exposure and the focus) by using the reference database 301 that has previously been constructed using the FEM wafer (steps 2034-2036).

[0159] First, referring to FIG. 32, a method for calculating the height of the resist pattern will be described. FIG. 32(a) is the top-down view image and FIG. 32(b) is the tilt image. If, representing the edge width in the top-down view image by X1 and the edge width in the tilt image by X2, X1 and X2 are substituted into an equation attached to FIG. 32(c), the height h of the resist pattern can be found because the tilt angles α1 and α2 are already known (α1=0, α2=a stage tilt angle of FIG. 31). FIG. 32(c) is an excerpt from “Electron Beam Testing Handbook,” Japan Society for the Promotion of Science, the 132nd Committee of “Applications of Charged Particles to Industries,” Research Material No. 98, p. 269.

[0160]FIG. 33(a) shows stored information of the reference database 301 as in this embodiment. What is different from the first embodiment is that the height of the resist pattern is included in the group of feature quantities. The group of feature quantities may be obtained from the top-down view image, may be obtained from the tilt image, or may be obtained from both images.

[0161] Since the steps 2034-2036 in FIG. 30 are basically the same as the steps 2003-2005 in the first embodiment, explanation thereof is omitted.

[0162] According to this embodiment, there is an advantage that feedback quantities ΔE and ΔF of the exposure conditions can be obtained more accurately because of addition of information of the height of the resist pattern, in addition to the same effect as described in the embodiment No. (1-0).

[0163] Note that instead of making the stage be tilted, a column of an electro-optical system may be tilted, or the incident angle of the irradiation electron beam to the sample may be altered by changing a deflection angle of the beam.

[0164] Also note that this embodiment may be combined with the fourth embodiment. In the fourth embodiment, as the resist height is unknown, a suitable value was assumed. If the height obtained in such a way as described above is used, the pseudo cross section that agrees even much with the actual cross section can be obtained. Stored information of the reference database 301 in the case where this embodiment is combined with the fourth embodiment is shown in FIG. 33(b).

[0165] Further, a method may be adopted whereby not only the top-down view image and the tilt image are used to obtain the resist height but also the cross section is reconstructed based on a principle of stereoscopic vision and the result of the reconstruction is used as the feature quantities as with the pseudo cross section in the fourth embodiment.

[0166] Moreover, in the tilt image, as shown in FIG. 32(b), the number of pixels increases in the left resist side-wall part (more accurately, an area corresponding to the left resist side-wall part) and in the flat part(more accurately, an area corresponding to the flat part), whereas the number of pixels in the right resist side-wall part (more accurately, an area corresponding to the left resist side-wall part) decreases (in the case where a slope of the tilt stage is upward to the right to the sample). What should be marked in this embodiment is the line profile corresponding to the resist side-wall whose number of pixels was increased. As shown in FIG. 43, if the inclined plane can be detected with a sufficiently wide span, the middle part (FIG. 43b) of the inclined plane is hardly affected by the edge effect and the amount of signal in proportion to the slope angle can be detected stably.

[0167] Then, utilizing this relationship between the amount of signal and the slope angle, the amount of signal of the resist side-wall part can be used as a feature quantity that indicates the slope angle of the resist side-wall. For example, the edges of the top and the bottom of a resist pattern are extracted, the intensity of the middle portion between the two edges are averaged, and the average value is assumed to be the feature quantity that indicates the slope angle of the resist side-wall. As described in the fourth embodiment, since the electron beam image of the SEM becomes brighter as the slope angle becomes larger, the increase/decrease in this feature quantity can give an idea of the change in the slope angle. If the relationship between the slope angle and the amount of signal has previously been obtained using a sample with a known slope angle, higher-precision evaluation becomes possible. If information of the resist film thickness is used in combination with this relation, it is optionally possible to estimate a rough sectional shape of the pattern.

[0168] Further, as with the embodiment of FIG. 11, if the waveforms of the top part (FIG. 43c) and the bottom part (FIG. 43a) are utilized, the states of the rounding and the footing can be evaluated together. These pieces of information can be all used as the feature quantities in the above-mentioned first embodiment.

[0169] According to this embodiment, in addition to the same effect as described in the first embodiment, higher-precision feature quantities can be obtained because the number of pixels corresponding to the side-wall part increases with the use of the tilt image, and consequently more accurate prediction of the exposure conditions can be realized. Additionally, the dimension measurement of a reverse-taper that cannot be measured with the top-down view also becomes possible for a certain range of tapers. Since the slope angle can be obtained directly using the amount of signal of the inclined plane, the dimension measurement becomes hard to be influenced by the measurement error of the pattern width. Incidentally, the incident angle of the electron beam onto the sample may be altered by tilting a column of the electron optics system or by changing the deflection angle of the irradiation electron beam, instead of tilting the stage. Further, it goes without saying that this embodiment can be combined with the second and third embodiments.

Sixth Embodiment

[0170]FIG. 34 is a conceptual diagram of the lithography process that has a lithography-process monitoring system constructed on the CD-SEM 200, according to the sixth embodiment of the present invention. In the previously stated fifth embodiment, the resist height is calculated on the CD-SEM. However, in this embodiment, the result of measurement performed by some measuring means outside the CD-SEM is used as the resist height in obtaining the pseudo cross section in the fourth embodiment. Concretely, the measurement result by film thickness measurement 2041 performed after the resist coating or the measurement result by resist height measurement 2042 performed after the resist development is used. In the fourth embodiment, a suitable value is assumed as the resist height because it is unknown. According to this embodiment, the pseudo cross section that agrees with the actual cross section to a higher degree can be obtained. Further, since it is not necessary to obtain the tilt image, this embodiment has an advantage that the throughput is higher compared to the fifth embodiment. Moreover, it goes without saying that this embodiment can be combined with the second and the third embodiments.

Seventh Embodiment

[0171]FIG. 35 is a conceptual diagram of the lithography process that has the lithography-process monitoring system constructed on the CD-SEM 200, according to the seventh embodiment of the present invention. The CD-SEM used in this embodiment has reflection electron detectors 209, 210, as shown in FIG. 36, and can obtain a shaded image as shown in FIG. 37(a), (b) in addition to the normal top-down view image.

[0172] In this embodiment, the CD-SEM first obtains the normal top-down image and the shaded image (step 2051), subsequently calculates the slope angle of the edge of the resist pattern from the shaded image (step 2052), further calculates the group of feature quantities that represent the characteristics of the 3-D shape of the resist pattern (step 2053), and evaluates the 3-D shape based on the group of feature quantities, and at the same time calculates the feedback quantities ΔE and ΔF to the exposure condition parameters (the exposure and the focus) by using the reference database 301 that has previously been constructed using the FEM wafer (steps 2054-2056). Further, as with the fifth embodiment, the height of the pattern may be detected and the feature quantities of the side wall may be obtained by using the tilt image of the reflection electrons.

[0173] According to this embodiment, in addition to the same effects as described in the embodiment No. (1-0), there is an advantage that the feedback quantifies ΔE and ΔF of the exposure conditions can be obtained more accurately because a piece of information, a slope angle of the edge of the resist pattern, is additionally provided.

[0174] Also it goes without saying that this embodiment can be combined with the second and third embodiments.

Eighth Embodiment

[0175] The eighth embodiment of the present invention relates to a method for constructing the reference database. In the embodiments described up to the seventh embodiment, the reference database is constructed by using an electron beam image of the actual wafer. However, in this embodiment, the reference data is created by simulation on a computer.

[0176]FIG. 38 shows a flow of creating the reference data. First, the resist cross sections under various exposure conditions (the exposure and the focus) are obtained by running simulation of the resist cross section (step 2061) and these shapes are stored in the reference database (step 2062). Further, the line profile of the electron beam image in the obtained cross section is obtained by running simulation (step 2063) and is stored in the reference database (step 2064). For a simulator, for example, VS-M/BE (product name for package software by Fuji Research Institute Corporation) is used. From this line profile, the group of feature quantities are calculated in the same manner as the first embodiment (step 2065) and are stored in the reference database (step 2066). Although not being illustrated in the figures, it goes without saying that it is necessary for simulation conditions under which the results in good agreement with actual situation can be obtained to have been obtained before the simulation is performed.

[0177] When the evaluation of the 3-D shape of the resist pattern and the calculation of the feedback quantities are performed by using the line profile calculated from the resist pattern subject to inspection, the reference data stored at the step 2064 is used.

[0178] When the feature quantities calculated from the resist pattern subject to inspection, the reference data stored at the step 2066 is used.

[0179] When the predicted cross section of the resist pattern subject to inspection (namely, the pseudo cross section calculated in the fourth embodiment or in the sixth embodiment, or the reconstructed result using the tilt image in the fifth embodiment) is used, the reference data stored at the step 2062 is used.

[0180] According to this embodiment, since it is not necessary to acquire the electron beam images for various exposures and foci, there is an advantage that a time required to create the reference database can be shortened.

Ninth Embodiment

[0181] A method for applying the monitoring system for the photo process that was elucidated though the embodiments up until the preceding embodiment to the etching process is shown in FIG. 40 as the ninth embodiment.

[0182] Also in the etching process, the process control can be executed by the same method as that of the photo process, but the following points can be enumerated, especially as the characteristics of the etching process: (1) A post-etching pattern shape is a final shape of the circuit pattern and a target shape differs according to what the process concerned is; (2) The etching has a lot of parameters of the processing conditions, hence being complicated; (3) Uniform processing is essential over the whole wafer surface; (4) It is difficult to execute the condition finding (contrary to the FEM of the photo process, the processing under various conditions cannot be done at a time); (5) The etching varies largely according to elapsed time due to fouling in a processing chamber. A method for realizing a system for monitoring an etching process in consideration of these characteristics will be described in the following.

[0183] In the process with the exposure equipment, it is possible to peel off the resist and re-process it; in the process with the etching equipment (etcher), it is impossible to do re-processing. Therefore, it is requisite to feedback the variations to maintain the dimensions within the tolerances. Also in the etching equipment, the same effects as those of the aforesaid exposure equipment can be obtained by evaluating the post-etching pattern shape and controlling equipment parameters that govern the state of a processed shape.

[0184] To achieve it, all that are required is that the shape of the pattern manufactured through a predetermined process is evaluated in terms of a degree of agreement with the target shape with the use of sets of the measured values of the line profiles shown in the previously stated embodiment No. (1-2), the correlation value of the line profile shown in the embodiment No. (1-3), and the correlation value of the actual electron beam image, and the differences obtained by the evaluation are fed back to the etching equipment.

[0185] As shown in FIG. 41, the processed shape to be produced by the etching process is determined by the requirements of the semiconductor device and differs depending on the target product and the process concerned. Therefore, it is preferable that such feature quantities as are suitable for evaluation of the target shape is selected and used. For example, in the wiring process, as one of the feature quantities including the wiring widths corresponding to the top part and the bottom part, a dimension showing a strong correlation with the top width and the bottom width, among the dimension 1 and the dimension 2 in FIG. 19, can be selected and used. In the case of gate wiring, the width of a gate oxide film part produced on the bottom part of the wiring is most important, it is effective that in addition to the wiring width the footing feature quantity of the bottom part is added to the feature quantities.

[0186] Further, in the etching process, it is important to secure the uniformity over the wafer surface, process monitoring such that the evaluation is performed at plural points in the wafer and the uniformity is considered is executed as with the example of FIG. 23(b). Details will be described later.

[0187] Next, the processing conditions that are to be stored in the reference database, being associated with the above-mentioned feature quantities. Compared to the exposure equipment, the etching equipment has a lot of parameters each exerting an influence on processing performance. For example, in the case of dry etching, it is necessary to control the kinds of gases used, a mixing ratio, a gas pressure, a high-frequency power, a temperature, and an etching time, etc. Consequently, in the ninth embodiment, parameters that are comparatively easy to be altered are selected from among these control parameters and the processed shape is controlled.

[0188] For example, in the case of FIG. 40, the etching time is used as the etching parameter to be adjusted. Using the wiring dimension selected as the feature quantity, if this dimension deviates from the tolerance, and if this dimension is larger than the target value, the etching time is increased; if it is smaller than the target value, the etching time is decreased. At this time, if information of processing conditions for etching the specimen in a proper shape and information of differences between the evaluated values of the pattern under that conditions and the evaluated values of the pattern processed under conditions whose parameter to be controlled (in case of FIG. 40, etching time) was altered to that conditions are both stored in a reference database, control amount of the etching time is determined based on the reference database.

[0189] With this method, actually varying parameters of the manufacturing equipment can not always be adjusted directly. For example, in the case of the example of FIG. 40, the processed shape is made to come close to the predetermined target values by the control of the etching time in actual situation even when the processed shape is varied due to variation of other conditions such as the gas pressure of the etching equipment etc. Therefore, when the adjustment parameter is different from a variation cause, the shape can not always be controlled perfectly. However, in the case where there are many control parameters as with the etching equipment, an optimal combination of the processing conditions is not limited to one, and when the variation quantities are small, correction is possible by using the different parameter.

[0190] Further, in the case of gentle variation, not only the variation of the etching equipment but also the variation of the exposure equipment can be countervailed with the alteration of the etching condition in a similar manner (details will be described later). Note that, if shape variation results from the fouling in the processing chamber, wear of the parts, etc., there can be conceived a case where mere alteration of the processing conditions cannot countervail the variation sufficiently. It is recommended that the system is configured so as to display an error message, in such a case, that there does not exist a parameter whereby the variation can be countervailed, by using the display and communication means 503 in FIG. 42.

[0191]FIG. 40 illustrates a system that reconsiders the processing conditions of the etching equipment such as the etching condition (here, the etching time) etc. based on the group of calculated pattern-shape feature quantities by referring to the reference database, corrects the recipe of the etching equipment in line with the results, and controls the etching equipment. However, naturally there may be adopted a scheme such that data of the group of calculated pattern-shape feature quantities are displayed, the results of referring to the reference database are displayed, the corrections of the etching condition are displayed on the screen, and the operator executes the alteration of condition according to these pieces of information.

[0192] In the example of FIG. 40, all the operations of the acquisition of the electron beam images through the quality judgement of the pattern shape plus the improvement of the processing conditions are performed on the CD-SEM. However, there may be adopted a scheme such that, in the production line of FIG. 42, only the acquisition of the images is performed on the CD-SEM 200 and the remaining processes are performed in the QC data collection and analysis system 501 and the equipment control system 500 or by using other computer connected with these systems. The alteration of the processing conditions may be done automatically by the equipment control system 500, or naturally may be done by a human operator who confirms the results and gives instructions for the alteration of conditions by the display and communication means 503.

[0193] In the example of FIG. 40, the etching time is selected as the control parameter. However, naturally other control parameter may be selected and a combination of a plurality of (two or more) parameters, such as the focus and the exposure of the exposure equipment, may be selected. In this case, a reference database of a multi-dimensional combination become necessary.

[0194] Further, in this case, if suitable functions expressing these relationships are introduced, the same control as the embodiment No. (1-1) can be implemented. In the etching process, since the processing conditions cannot be altered on a single wafer as is the case with the FEM wafer in the photo process, it takes much time than the photo process to create the database. Therefore, a larger speed-up effect can be achieved by introducing the functions as with the embodiment No. (1-1).

[0195] Further, also in the case of the etching process, if such a system as shown in FIG. 31 and FIG. 36 is utilized, more detailed information of the 3-D shape can be obtained as with the fifth embodiment and the seventh embodiment. In addition, if the tilt image of the side-wall part is used, it becomes possible to apply this method to the reverse-taper and also to detect the abnormality such as notches generated at the bottom part of the pattern, in addition to the same advantage as those of the photo process. Moreover, since the side wall is observable, even in the case of a multi-layer film, it becomes possible to obtain useful feature quantities by a method for subdividing the region according to a material or the like.

[0196] Further, as with the sixth embodiment, information of film thickness of the film subject to etching can be utilized. Regarding this film thickness value, a manufacture specification values may be previously registered for each product and for each process, or data thereof may be acquired by other means for each product wafer with which the manufacture is set about. The film thickness in the film formation process is controlled in a comparatively rigorous manner by using an optical film thickness gage 506 etc. so that variation thereof is controlled to be within a few to a few tens nanometers with respect to a film thickness of a few hundred nanometers. Especially in the etching process, since the pattern surface is protected with a resist mask, the film thickness can be regarded as almost constant.

[0197] For example, in the system of FIG. 42, the film thickness specification of the film subject to processing of the wafer concerned can be obtained through the equipment control system 500. Further, if the film thickness measurement is being performed, high-precision film thickness information can be obtained by acquiring film thickness information that was actually measured by the film thickness gauge 506 from the QC data collection and analysis system 501.

[0198] Moreover, for the processing state of the etching, there are simulators such as PLATAN-ETCH etc., and the same processing as that of the eighth embodiment can be performed by using one of them. In the etching process, since it takes extremely much time to create the reference database, the effect of shortening the required time through the use of the simulator is much larger than that in the photo process.

[0199] Furthermore, in FIG. 40, only when one or more of the feature quantities of the pattern shape exceeds the tolerances, the alteration of the parameters is executed. However, as with the third embodiment in the photo process, even when the pattern shape is within the tolerances, the parameters may be altered.

[0200] Next, one example of the GUI screen in the process monitoring system elucidated in FIG. 40 is shown in FIG. 44. In the etching equipment, since the pattern shape may vary due to adhesion of byproducts generated during the processing to the interior of the chamber and the wear of parts, periodic cleaning and part replacement are conducted. In the method and system according to the present invention, these maintenance records of the equipment and transition of the feature quantities obtained from the SEM images are displayed together. As shown in FIG. 44(a), the time series data 510 are displayed in graphical representation, independently for each feature quantity, and at the same time a table of the maintenance record 511 is displayed. The maintenance record in the graphical representation is displayed with different colors being assigned to different descriptions and the maintenance record indication 512 is displayed also on the graph so that corresponding time can be read therefrom. Incidentally, in the time series data graph, a target value 513 and a tolerance 514 are also displayed together with the above data.

[0201] These displays are done for every pieces of etching equipment separately. In the case where pieces of data belonging to the one and same etching equipment exist on different critical dimension SEMs and these SEMs and the etching equipment are linked with one another via a network as in FIG. 42, these pieces of data can be transferred and displayed. Further, the reference database is not necessarily on the SEM, but it may be on other site connected with the etching equipment via the network. The horizontal axis represents any data that corresponds to an order of commencement of work of the equipment concerned, such as date of commencement of work of the wafer concerned, accumulative working hours of the etching equipment concerned, accumulative number of wafers with which the work was started in the etching equipment concerned. The screen of FIG. 44(a) is configured so as to display each of the feature quantities separately, but a plurality of feature quantifies may be displayed simultaneously in a single graph or they may be converted into a value that represents the whole state, such as a sum of these values, and be displayed.

[0202] Further, FIG. 44(a) displays each of the feature quantities separately, but as shown in FIG. 44(b) naturally the etching parameters inferred from the obtained feature quantities may be displayed. In the example of FIG. 44(b), as with the case of the third embodiment, a case where the processing parameters are always controlled, displaying adjustment quantities 521 together with the variation quantities of the etching conditions 520. If doing in this way, it can easily be confirmed what degree of the alteration of condition is being executed and how much there are variations each of which cannot be countervailed even with the alteration of condition. Further, together with the display of FIG. 44(a) or (b), outputs of various kinds of sensors (pressure gauge etc.) installed in the etching equipment may be displayed. Since the outputs of these sensors indicate the state of the equipment when the wafer is being processed, simultaneous display enables the operator to confirm the influences of the variations of the equipment upon the pattern shape easily.

[0203] Regarding the display of the process window and the display of the evaluation results of the current wafer, it is a matter of course that the same display as those of FIG. 15 and FIG. 16 may be conducted. At this time, it is preferable that the display is conducted with the use of the etching parameters instead of the exposure and the focus.

[0204] Thus, according to this embodiment, also in the etching process as with the exposure process, advanced process control becomes feasible and the processing of the pattern can be conducted excellently. Further, since an actual state of the etching equipment and the maintenance records can easily be confirmed together with the group of feature quantities defining the pattern shape and variations of the etching condition parameters that correspond to the shape variation; therefore, the state of the equipment can easily be grasped and in case of occurrence of the abnormality a rapid countervailing measure can be performed.

Tenth Embodiment Adding In-plane Uniformity in Evaluation Parameters+GUI

[0205] Next, referring to FIG. 45, the tenth embodiment will be described. In the etching process, unlike the photo process, it is extremely important to secure the processing uniformity over the wafer surface in order to realize excellent processing. Then, in this embodiment, in addition to several feature quantities such as the wiring width, the rounding, and the footing, the in-plane uniformities of these feature quantities are added as new feature quantities. For example, for chips designated by black color in FIG. 45(a), the SEM images are acquired. Next, as shown in FIG. 45(b), a distribution over the wafer of a certain feature quantity (for example, the wiring width) is obtained and a ratio of the maximum value to the minimum value of this feature quantity or the difference between them is employed as a new feature quantity. The above is all that needs to be done. At this time, there is not necessarily a need to obtain in-plane distributions for all feature quantities, and it is only recommended that, for an especially important feature quantity in the process intended to be controlled, a distribution of the feature quantity over the wafer surface is calculated. By providing a new feature quantity like this, a process control that considers the uniformity over the wafer surface can be executed and this will enable application of this system to larger-diameter wafers.

[0206] Further, a display example of the uniformity over the wafer surface is shown in FIG. 46. FIG. 46(a) displays an in-plane distribution of the wafer that was measured for a certain feature quantity (for example, the line width) with different colors each assigned to a different magnitude of the feature quantity. Instead of the graphs (401 a, 402 a, 403 a, etc.) that show parameter dependencies of the respective feature quantities in FIG. 15, a graph of FIG. 46(a) may be used. Moreover, in FIG. 46(b), a process window for a certain feature quantity is displayed for different position in the wafer plane, for example: wafer center, wafer middle, and wafer peripheral. By displaying the process window in this way, the uniformity over the wafer surface of the post-etching pattern shape can easily be checked.

Eleventh Embodiment Condition Finding+Method of Creating Reference Database

[0207] Principal processing conditions of the etching process include etching time, electric power of plasma discharge, bias electric power applied to the sample, a flow rate (ratio) of a process gas and its pressure, wafer temperature, etc. If these conditions are set to proper values, a pattern of the desired shape cannot be produced. Since these parameters affect each other, it is highly difficult to set the optimal conditions, and in the present circumstances the setting is done mostly by means of the experience and intuition of experts.

[0208] Contrary to this, the present invention shows the feature quantities defining the shape with functions as in the embodiment No. (1-1), and thereby shortens a time required for the condition finding. FIG. 47 shows a condition-finding procedure according to the present invention. FIG. 47(a) shows a current condition-finding procedure whereby the processing and the cross-sectional observation are repeated for the quality judgement of the pattern. Unlike the FEM in the photo process, the pattern with different processing conditions cannot be produced on a single wafer and a set of the etching conditions requires a single sheet of wafer; therefore if this iterative loops increase in number, the cost of the condition finding naturally increases. Consequently, compared to the photo process, the creation of the reference database as a matter of course and the determination of the optimal conditions require much time and cost. This number of iterations may differ depending on the skills of the expert. If the relationship between the etching conditions and the shape can be evaluated quantitatively, this iterative operations can be decreased in number and hence the condition finding is facilitated.

[0209]FIG. 47(b) illustrate the condition-finding procedure according to the present invention. In the beginning, functions each of which expresses the =relationship between one of the condition parameters and the feature quantities defining the shape are obtained roughly at the steps 2200-2205.

[0210] As an example, a case in which the wiring is formed being embedded in a trench of an oxide film by means of damascene processing is described as follows. In this case, adjustment is executed by using the etching time and the gas pressure as principal parameters. Here, as a criterion of the etching conditions, such a feature quantity as has high correlation with the dimensions in concern is selected. For example, as the feature quantities including the wiring widths that correspond to the top part and the bottom part, respectively, a dimensions that is closely correlated with the top width and the bottom width is selected and used among a dimension 1 and a dimension 2 of FIG. 19. For example, the dimension 1 and the dimension 2 as illustrated in FIG. 19(a) at a height of b=10% are specified to be the bottom width and the top width, respectively. FIG. 48 shows a relationship between these feature quantities and the processing conditions that is to be obtained.

[0211] Normally there are standard processing conditions according to a material to be processed and a shape to be formed, and the conditions are optimized to an object product and a process. Further, it is often the case that a qualitative property of each parameter has been understood in some measure (for example, “as the etching time is prolonged, the amount of etching increases”). Then, to begin with, the processing is executed under the pre-optimization standard conditions (step 2200 in FIG. 47) and the top part width and the bottom part width that are the feature quantities are evaluated (step 2201 in FIG. 47, points designated by solid circles in FIG. 48).

[0212] Based on this result, a second process (step 2202) such that each single parameter is altered by a suitable value and the other conditions are kept as the standard conditions is executed and the feature quantities are evaluated (step 2203; refer to points designated by open circles in FIG. 48). At this time, if the qualitative property of each parameter has been known, the value is set toward such a direction in which the feature quantities approach their target values. For example, if a dimension is intended to be a target dimension smaller than the existing one in FIG. 48(a), the etching time is set to be longer and evaluation is performed.

[0213] By this evaluation, the relationship between variation quantity of each parameter and the variation quantities of the feature quantities can be grasped roughly. This relation (dotted straight line shown in FIG. 48) is assumed to be an initial function, and the feature quantities of the target shape is temporarily determined (step 2205).

[0214] Here, it is preferable that the processed results under the standard conditions and those under the second conditions are properly checked for the quality of their shapes (step 2204) by using an AFM and with the use of the cross-sectional observation. Note that, if these feature quantities have previously been calibrated by other means, the step 2204 is not necessarily required. Thus, if these shapes have previously been evaluated properly, now the judgment of good or bad on the processed shape can be performed only with the feature quantities of the SEM image with the help of these results.

[0215] The use of the initial functions thus obtained makes it possible to predict which value the selected parameter should be set to, in order to realize the desired shape with the selected parameter. Therefore the conditions are narrowed down by utilizing them. At a step 2206, the following processing conditions are set by using these initial functions. In the example of FIG. 48, the following difference in the characteristics has been turned out: as the etching time is altered, both the top width and the bottom width change similarly (FIG. 48(a)), but as the gas pressure is altered, only the bottom width changes (FIG. 48(b)). Considering these characteristics as well as the difference between the feature quantities under the standard conditions and the target values, principal parameter(s) to be altered is determined.

[0216] For example, if the target dimensions are fixed as shown by gray lines in FIG. 48, it is recommended that the parameter of the gas pressure is tried to be altered to a range indicated by hatching in FIG. 48(b) or its neighbors, which is designated as an intersection area of the prediction lines for the characteristic and the tolerances, and then a value that was found to be capable of realizing the desired shape is selected. This is the same operation as that in the first embodiment executed in calculating the variation quantities of the parameters to select the conditions under which the deviations of the group of feature quantities from the target values become minimum. At this time, if there are a plurality of parameters that can alter the shape similarly, it is recommended that one of the parameter be selected by considering the throughput, ease of alteration of the parameter, stability of the process, etc.

[0217] Such selection of the parameters can be executed by automatic calculation as well if a proper evaluation function that considers the deviations from the target values and ease of alteration of each parameter is set. In this occasion, if a plurality of parameters are selected, the alteration quantities are adjusted with synergistic effects being considered. Note that, here each processing condition parameter is altered once to the standard parameter as a second processing conditions and a trend is grasped by simple linear approximation. However, a plurality of alterations of the condition may be executed and much more pieces of data may be used for the adjustment. In this case, according to several pieces of acquired data, a suitable method other than the linear approximation may be employed.

[0218] Subsequently, (1) the processing (step 2207), the evaluation (step 2208), and the judgment (step 2209) are performed, (2) based on the results, the function of the feature quantities versus the processing parameters and the feature quantities of the target shape are corrected (step 2210), and (3) the next processing conditions are determined (step 2206). The series of operations are repeated until the target shape is obtained. When the etching conditions under which the feature quantities of the target shape can be obtained are determined, the cross-sectional observation of the processed wafer is performed, and if there is no problem, the condition finding is completed.

[0219] Thus, in the present invention, since the conditions are altered based on quantitative evaluation results, the etching conditions can be brought to convergence without fail. Further, since the iterative loop for the alteration of condition consisting of the steps 2206-2210 do not include the cross-sectional observation that is most time-consuming, faster condition finding compared to the conventional technique can be realized.

[0220] Naturally, if the cross-sectional observation is performed for some processing conditions similarly with the conventional method and the measured values are calibrated, the reliability of the condition finding can be further improved. Thus, by using the feature quantities, condition setting can be made quantitatively and efficiently, not by performing the cross-sectional observation every time, but only by conducting confirmation at important points.

[0221] In FIG. 48, the widths of top part and of the bottom part are used as the feature quantities for shape evaluation. It is recommended to use such feature quantities as express characteristics of an important shape for the pattern to be processed, for example, a slope angle of the side-wall, indices of the rounding and footing, etc. When the indices of the rounding and footing are used as the feature quantities, it is difficult to estimate an absolute shape with the index-values alone. However, for example, if the radius of curvature of the corner part was measured by the cross-sectional observation of the processed results for the standard conditions and those for the conditions whose parameters were altered and then the relationship between the index value and the radius of curvature has been obtained, the indices at the desired shape can be estimated.

[0222] Note that this embodiment shows an example where the standard conditions are known. In the case where totally new material and structure are going to be examined to find their characteristics but it is not yet clear that which parameter will exhibit what characteristics, a condition-finding technique that uses the experimental design, Taguchi-method, or the like is effective. Also in such a case, the optimal conditions can be determined with the use of the feature quantities obtained by this system as evaluation values of workmanship.

[0223] Further, at the time of etching condition finding like this, if the reference database has been created simultaneously, it can be used for the process control in the above-mentioned ninth embodiment. In this embodiment, the iterative operations are performed only under conditions close to final conditions, but the database that is used when the process is actually monitored and controlled is enough provided that the shape variation close to the desired shape can be calculated therewith, and hence data that is stored at the time of the condition finding in this embodiment is sufficient.

Twelfth Embodiment

[0224]FIG. 39 is a conceptual diagram of the lithography process that has the lithography-process monitoring system, according to the twelfth embodiment of the present invention. In the twelfth embodiment of the present invention, the process control is executed by using the shape information that was obtained from the electron beam images of the resist pattern and the post-etching pattern, both of which are of the product wafer subject to inspection.

[0225] Hereafter, referring to FIG. 39, the procedure will be described. First, as with the above-mentioned embodiment of No. (1-0) etc., the shape of the resist pattern after the exposure is evaluated and the variation quantities of the exposure conditions are calculated (step 2220, 2221). The calculated variation quantities of the exposure conditions are compared with the tolerances of the photo process that have previously been recorded in the reference database (step 2222), and if the criteria are satisfied, the normal etching conditions, as they are, are set (step 2224) and the flow proceeds to the etching process (step 2225).

[0226] Here, if the criteria are not satisfied, by referring to the correspondence relationship between the exposure conditions and the etching conditions that has previously been recorded in the reference database, it is judged whether or not unconformity of the criteria can be countervailed with the alteration of the etching conditions (step 2223). If the countervailing measure is feasible, the etching condition is altered (step 2224) and the etching process is executed (step 2225); if the countervailing measure is impossible, the peeling off of the resist and the re-exposure are executed (step 2225). Contests of the database that provides this relationship between the exposure conditions and the etching condition and how to create it will be described later. These steps 2220-2224 are performed in the CD-SEM 200. At this time, it is by referring to the reference database 301 that the steps 2221 to the step 2224 are performed. Here, it should be noted that FIG. 39 shows an example wherein calculation results of the exposure conditions at the step 2221 is always fed back to the exposure equipment as with the third embodiment, but naturally there may be adopted a method whereby suitable tolerances are set, and are corrected only when the calculation results exceed the tolerances, as with the embodiment No. (1-0).

[0227] This feedback is executed automatically through the data collection and analysis system and the equipment control system of FIG. 42. Alternatively, there may be adopted a scheme such that, only when the calculation results exceed the tolerances, this fact is informed to an operator and a production line manager on a CD-SEM screen, through the display and communication means 503 of FIG. 42 via a network, etc.

[0228] Next, also for the post-etching pattern, the shape feature quantities are evaluated (step 2226) and it is judged whether or not the abnormality exists in the processed shape (step 2227). The result can be confirmed on the GUI screen of the CD-SEM or by the display and communication means 503 shown in FIG. 42. Here, when the process results are not normal, and if the abnormality is judged to attribute to the variation in the etching process in consideration of the variation of the exposure conditions and the alteration of the etching condition, the countervailing measure of the device concerned and the alteration of the processing conditions are executed. These steps 2226 and 2227 are performed in the CD-SEM 200 by referring to the reference database 301. Moreover, the method concerned may be executed in such a way that from the calculated shape feature quantities, the variation quantity of the etching condition parameter that acts as a countervailing measure against the change in the shape is calculated and the condition of the etching apparatus is automatically altered as with the case of the exposure equipment.

[0229] That is, the pattern is evaluated after the exposure and the etching, and if the exposure process is found to be the cause of the shape variation, the conditions of the exposure process are changed back to an optimal condition, and at the same time, the etching conditions for the wafer in which the abnormality was detected is altered, and thereby possible influence of the abnormality in the exposure process is absorbed, so that the post-etching pattern shape is guided to a good state. On the other hand, if there is a problem in the etching process, a countermeasure for equipment of the etching process is devised and/or the processing conditions are altered. Here, regarding the feature quantities acquired from the SEM image, any of the feature quantities described in the above-mentioned embodiments may be used.

[0230] Further, in FIG. 39, operations from the image acquisition of the pattern to the judgement of evaluation results of the shape are performed on the CD-SEM. However, naturally any procedures except the acquisition of the electron beam image may be performed on other computer(s) that is linked with the CD-SEM via a network.

[0231] Next, a method for creating a database that describes the relationship between the exposure conditions and the etching condition will be described. In order to obtain proper etching condition for the variation quantities of the exposure and focus in the photo process, according to points for creating the process window shown in the embodiment No. (1-0) and in the fourth embodiment, a database is created that describes the relationship among the processing conditions in the photo process (the exposure and the focus), the feature quantities of the processed results, and the tolerances thereof, using the condition-finding wafer (FEM wafer) in the photo process shown in FIG. 4.

[0232] Referring to FIG. 50, a procedure of creating the reference database will be described. To begin with, plural sheets of the FEM wafers shown in FIG. 4 will be produced (step 2240). Next, the feature quantities of the images of these FEM wafers are calculated (step 2241) and stored in the reference database together with the exposure conditions (step 2242) as with the embodiment No. (1-0). Subsequently, the produced FEM wafers are subjected to the etching process under the optimal conditions and also under several conditions other than the optimal conditions (step 2243) and the feature quantities of the SEM image are calculated for those wafers (step 2244). Finally, the exposure conditions under which obtained feature quantities of the image satisfy the tolerances of the final shape are checked up on each wafer and these relationships are stored in the reference database (step 2245).

[0233] Next, referring to FIG. 49, detailed contents will be described. The description will be made for the case where the etching time is controlled for the oxide film etching shown in the eleventh embodiment. For example, consider that the etching condition is the etching time, and the exposure condition-finding wafers shown in FIG. 4 are etched for three kinds of etching times, respectively.

[0234]FIG. 49 shows results of the etching of the wafers each of which has been processed with varied conditions of the exposure and the focus. The x axis represents the focus, the y-axis represents the exposure, and a box area enclosed with solid lines represents the optimal exposure conditions. A patterned region consisting of hatched box areas represents a “process window,” wherein each hatched box area represents a different set of the exposure conditions such that the post-etching shape under the conditions is judged to be within tolerances by the evaluation of the feature quantities. The figures (a), (b), and (c) are the results of etching under different etching times, respectively, wherein the optimal etching time for a normally exposed pattern is the condition of (b). With this process window, for example, the following knowledge can be obtained: if the focus and the exposure were (Fa, Ea) due to the abnormality of the photo process, the etching with the etching time T+ as illustrated in (c) will give a desired processed shape. Thus, if a set of the exposure and the focus in the photo process, the etching condition, and the feature quantities of the post-etching pattern shape have been recorded as a piece of data to create the database using the resist pattern shown in FIG. 4, even when the abrupt abnormality occurs in the photo process, a desired pattern shape can be obtained by the alteration of condition in the etching process.

[0235]FIG. 49(d) shows a logical sum of the hatched box areas in figures (a), (b), and (c). Only with the alteration of condition in the photo process, only the process window of FIG. 49(b) is allowed to yield the desired pattern shape; whereas, if the etching condition is altered, the process window of FIG. 49(d) is allowed to yield the desired pattern shape, which means that countervailing measure can be devised against wider variation in the photo process. Incidentally, a white-background portion in FIG. 49(d) are for cases where the desired processed shape could not obtained under any etching condition and conventional resist peeling off and re-exposure should be executed for those. In this case, a warning and/or an error message can be output, if necessary.

[0236] If the etching condition under which the desired pattern can be processed for each exposure conditions has been stored in the reference database based on these results, the process control illustrated in FIG. 39 becomes possible. Note that, if the desired shape can be obtained under plural values of the etching condition, it is naturally recommended to select a value of the condition under which a wider surrounding region consisting of box areas each giving the desired shape is given, namely a value of the condition whose process margin is the largest. Note also that, if there is a gap among the process windows (a), (b), and (c) conversely, it is recommended to form the FEM with an etching condition that falls between these etching conditions, to determine a suitable condition by interpolation, or other measures. It should be noted that although the parameter in the etching process is only the etching time having three different values in this embodiment, the kinds of parameters to be altered and the number of values for each parameter may be changed as the need arises.

[0237] According to this embodiment, focus drift at the time of exposure that is liable to be overlooked in the conventional method can be detected without fail by acquiring the information of the 3-D shape of each pattern in a non-invasive manner to monitor the process; therefore, when there arises the abnormality, which the cause is, the photo process or the etching process, can be determined on the spot. Consequently, investigation of the cause and its countervailing measure at the time of occurrence of the abnormality can be executed quickly. As a result, a stable process can be realized and high-volume occurrence of device defective that is caused by the abnormality of the pattern shape can be prevented. Further, even when the abnormality occurs in the photo process, the number of peeling off and reformation of the resist can be reduced from that is necessary in the conventional process.

Thirteenth Embodiment

[0238] In the above-mentioned twelfth embodiment, explained was the case where a condition-finding wafer of FIG. 4 was used. As the thirteenth embodiment, a technique of creating such a database as considers the uniformity of the etching will be described.

[0239] In the etching process, it is difficult to execute a uniform process over the whole wafer because of various factors such as distributions of a plasma and of process gas pressure in the chamber. Because of this fact, if the samples each having altered exposure and altered focusing are simply arranged in the manner as shown in FIG. 4 and the above-mentioned etching process is executed, the post-etching pattern shape is very liable to differ not only due to the difference of the exposure and the focus but also due to the influence of the uniformity of the etching process. Therefore, it is preferably to arrange the samples in consideration of the uniformity of the etching rather than altering the exposure and the focus sequentially as in FIG. 4.

[0240] As shown in FIG. 51, exposure shot is divided up into several groups (in the example of FIG. 51, group A to group D) according to the distance from the edge of the wafer, and a combination of shots, each of which has a different exposure and a different focus, is made for each group. That is, for each group, the samples are processed under the conditions of the combination of shots so that the data of the process window of the exposure and the focus shown in FIG. 49 can be obtained. By using these data, information of the uniformity over the wafer surface resulting from the etching process can be obtained in light of the difference between the feature quantities of the resist pattern before the etching process and that after the etching process.

[0241] For example, if one of the feature quantities of the pattern shapes that were formed under the same exposure conditions varies only after the etching, it is reasonable to consider that there is a problem in the etching process; and if one of the variation quantities of the feature quantities has a positional dependency in the wafer, information of the uniformity over the wafer surface resulting from the etching can be obtained and especially positions where a process margin is small and the degree thereof can be known quantitatively. For example, if the process window is displayed for each group similarly as in FIG. 46(b), the operator can confirm how the process margin of the lithography process including the photo and the etching processes differs depending on positions in the wafer.

[0242] Note that what is shown in FIG. 51 is a way of grouping positions in the wafer that uses a property that variation in the shape after etching process has a comparatively concentric distribution on the wafer. However, if there is knowledge that the variation has a different distribution depending on the exposure equipment, a way of grouping that matches such a distribution may be performed.

[0243] According to the present invention, wafers with a larger diameter can also be monitored similarly by executing a process control that considers the uniformity over the wafer surface, in addition to such advantages as can be obtained in the above-mentioned twelfth embodiment.

[0244] According to the present invention, the 3-D shape of the resist pattern can be monitored at the product level, which is the object of the invention, and thereby a lithography-process monitoring system capable of detecting not only the exposure drift but also the focus drift can be provided. As a result, an abnormality in the 3-D shape caused by the focus drift that has been overlooked by the conventional dimension measurement becomes detectable, so that the method according to the present invention can prevent a wafer having a defect that exists in the post-etching film pattern, hence being incapable of be reformed, from being put into the manufacture. Further, getting away from conventional feedback to the exposure equipment that is based on the experience and intuition, precise feedback to the process becomes possible because quantitative outputs are made possible. Moreover, by executing variation predictive control of the exposure conditions, the present invention can provide stable lithography.

[0245] The invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiment is therefor to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. 

What is claimed is:
 1. A system for monitoring a semiconductor device manufacturing process, comprising: image acquiring means for acquiring an electron beam image of a pattern produced on the surface of a substrate by irradiating the substrate, on whose surface the pattern was produced by being subjected to a predetermined treatment process, with the electron beam by scanning; calculation means for calculating feature quantities of said pattern from the electron beam image of said pattern obtained by said image acquiring means; storage means for storing the reference database that describes a relationship between processing condition parameters in said predetermined treatment process and the feature quantities of the pattern produced on the substrate by the substrate being subjected to said predetermined treatment process; and monitoring means for monitoring a state of said predetermined treatment process by referring to both the feature quantities of the electron beam image of said pattern calculated by said calculation means for calculating the feature quantities and the relationship between the processing condition parameters and the feature quantities of the pattern described in the reference database stored in said storage means.
 2. A system for monitoring a semiconductor device manufacturing process according to claim 1, wherein said monitoring means calculates variation quantities of the processing condition parameters in said predetermined treatment process and monitors a state of said predetermined treatment process based on said calculated variation quantities of the processing condition parameters.
 3. A system for monitoring a semiconductor device manufacturing process according to claim 1, wherein said monitoring means obtains corrections of processing conditions of said predetermined treatment process by using information of said calculated variation quantities of the processing condition parameters.
 4. A system for monitoring a semiconductor device manufacturing process according to claim 3, wherein said monitoring means corrects the processing conditions of said predetermined treatment process based on said obtained corrections of the processing conditions of said predetermined treatment process.
 5. A system for monitoring a semiconductor device manufacturing process according to claim 1, wherein said monitoring means displays time fluctuation of the feature quantities of the electron beam image of said pattern on the screen.
 6. A system for monitoring a semiconductor device manufacturing process according to claim 5, wherein said monitoring means displays parameters that indicate a state of said predetermined processing equipment obtained from said predetermined processing equipment together with time fluctuation of said feature quantities on the screen.
 7. A system for monitoring a semiconductor device manufacturing process according to claim 1, wherein said predetermined treatment process is either an exposure process or an etching process.
 8. A system for monitoring a semiconductor device manufacturing process, comprising: image detecting means for obtaining an electron beam image of a pattern produced on the surface of a substrate by irradiating the substrate, on whose surface the pattern was produced by being subjected to a predetermined treatment process, with the electron beam by scanning; means for calculating feature quantities of said pattern from the electron beam image obtained by said image detecting means; storage means for storing a reference database that describes a relationship between processing condition parameters in said predetermined treatment process and the feature quantities of the pattern produced on the substrate by the substrate being subjected to said predetermined treatment process and also a proper region of the feature quantities of the pattern produced on the substrate by the substrate being subjected to said predetermined treatment process; and judgment means that compares the feature quantities of the electron beam image of said pattern calculated by said calculation means for calculating said feature quantities with the proper regions that are described in the reference database stored in said storage means, and if any one of said feature quantities deviates from said proper regions, judges that variation quantities of said processing condition parameters exceed allowable errors.
 9. A system for monitoring a semiconductor device manufacturing process according to claim 8, further comprising monitoring means that calculates the feature quantities of said electron beam image with the calculation means for calculating said feature quantities from the electron beam image of the pattern produced on said substrate that was acquired by said image detecting means, calculates variation quantities of said processing condition parameters from said calculated feature quantities of the electron beam image by referring to a relationship between said processing condition parameters and the feature quantities of said pattern that are described in the reference database stored in said storage means, and monitors a state of said predetermined treatment process on the basis of said calculated variation quantities of the processing condition parameters.
 10. A system for monitoring a semiconductor device manufacturing process according to claim 8, wherein said monitoring means obtains corrections of processing conditions of said predetermined treatment process by using information of said calculated variation quantities of the processing condition parameters.
 11. A system for monitoring a semiconductor device manufacturing process according to claim 8, wherein said monitoring means displays information concerning said obtained corrections of processing conditions of said predetermined treatment process on the screen.
 12. A system for monitoring a semiconductor device manufacturing process according to claim 8, wherein said monitoring means displays time fluctuation of the feature quantities of the electron beam image of said pattern on the screen.
 13. A system for monitoring a semiconductor device manufacturing process according to claim 8, wherein said monitoring means displays parameters indicating a state of said predetermined processing equipment that is obtained from said predetermined processing equipment together with the time fluctuation of said feature quantities on said screen.
 14. A system for monitoring a semiconductor device manufacturing process according to claim 10, wherein said monitoring means corrects the processing conditions of said predetermined treatment process based on said obtained corrections of the processing conditions of said predetermined treatment process.
 15. A system for monitoring a semiconductor device manufacturing process according to claim 8, wherein said predetermined treatment process is either of an exposure process or an etching process.
 16. A system for monitoring a semiconductor device manufacturing process according to claim 8, wherein said feature quantities include three kinds of feature quantities of: (a) line width of the pattern; (b) a degree of rounding of a top part of the pattern; and (c) a degree of footing of a bottom part of the pattern.
 17. A system for monitoring a semiconductor device manufacturing process according to claim 8, wherein said feature quantities are a predicted cross section calculated from a line profile of said electron beam image.
 18. A system for monitoring a semiconductor device manufacturing process, the system comprising: first image detecting means for acquiring an electron beam image of a resist pattern produced on a substrate subject to processing that underwent an exposure process; first feature-quantities calculating means for calculating feature quantities of said resist pattern from said detect ed electron beam image; second image detecting means for acquiring the electron beam image of a circuit pattern that was produced by an etching process that uses the pattern produced by said exposure process as a mask; second feature-quantities calculating means for calculating feature quantities of said circuit pattern from said detected electron beam image; reference-database creating means for creating a reference database that describes (a) a relationship between the feature quantities of said resist pattern calculated by said first feature-quantities calculating means and exposure condition parameters in said exposure process, and (b) a relationship among said exposure condition parameters, etching condition parameters in said etching process, and the feature quantities of said circuit pattern; and etching-condition calculating means for calculating said etching conditions under which the feature quantities of said circuit pattern agree with desired values by using both (a) information of the feature quantities of said resist pattern calculated by said first feature-quantities calculating means and (b) information of the relationship among said exposure condition parameters created by said reference database creation means, etching condition parameters in said etching process, and the feature quantities of said circuit pattern.
 19. A method for monitoring a semiconductor device manufacturing process, comprising steps of: obtaining an electron beam image of a pattern produced on the surface of a substrate, on which the pattern was formed by being subjected to a predetermined treatment process, by irradiating said substrate with the electron beam by scanning; calculating the feature quantities of said pattern from said obtained electron beam image of said pattern; and monitoring a state of said predetermined treatment process by using both information of said calculated feature quantities of the pattern and information of a relationship between processing condition parameters in said predetermined treatment process stored previously and the feature quantities of the pattern produced on the substrate by the substrate being subjected to said predetermined treatment process.
 20. A system for monitoring a semiconductor device manufacturing process according to claim 19, wherein, at a step in which a state of said predetermined treatment process is monitored, variation quantities of the processing condition parameters of said predetermined treatment process are calculated; and the state of said predetermined treatment process is monitored based on said calculated variation quantities of the processing condition parameters.
 21. A method for monitoring a semiconductor device manufacturing process according to claim 20, wherein, at a step in which the state of said predetermined treatment process is monitored, corrections of processing conditions of said predetermined treatment process by using information of said calculated variation quantities of the processing condition parameters.
 22. A method for monitoring a semiconductor device manufacturing process according to claim 21, wherein, at the step in which the state of said predetermined treatment process is monitored, information concerning said obtained corrections of the processing conditions in said predetermined treatment process are displayed on the screen.
 23. A method for monitoring a semiconductor device manufacturing process according to claim 19, wherein, at the step in which the state of said predetermined treatment process is monitored, time fluctuation of the feature quantities of the electron beam image of said pattern is displayed on the screen.
 24. A method for monitoring a semiconductor device manufacturing process according to claim 19, wherein, at the step in which the state of said predetermined treatment process is monitored, parameters indicating the sate of said predetermined processing equipment that are obtained from said predetermined processing equipment are displayed together with the time fluctuation of the feature quantities of the electron beam image of said pattern on the screen.
 25. A method for monitoring a semiconductor device manufacturing process according to claim 21, further comprising a step of correcting the processing conditions of said predetermined treatment process based on said obtained corrections of the processing conditions of said predetermined treatment process.
 26. A method for monitoring a semiconductor device manufacturing process according to claim 21, wherein said predetermined treatment process is either of an exposure process or an etching process.
 27. A method for monitoring a semiconductor device manufacturing process, comprising steps of: obtaining an electron beam image of a pattern produced on the surface of a substrate on which the pattern was produced by the substrate being subjected to a predetermined treatment process by irradiating said substrate with the electron beam by scanning; calculating feature quantities of said pattern from said obtained electron beam image; and judging that, if the feature quantities of said pattern deviate from said proper ranges, the variation quantities of processing condition parameters exceed allowable errors by using following pieces of information: (a) said calculated feature quantities of said pattern; (b) a relationship between the parameters of processing conditions in said predetermined treatment process and the feature quantities of the pattern produced on the substrate by the substrate being subjected to said predetermined treatment process; and (c) proper ranges of the feature quantities of the pattern produced on the substrate by the substrate being subjected to said predetermined treatment process.
 28. A method for monitoring a semiconductor device manufacturing process according to claim 27, the method further comprising steps of: calculating variation quantities of said processing condition parameters by using both information of said calculated feature quantities of the electron beam image of said pattern and information of a relationship between the said processing condition parameters and the feature quantities of said pattern; and monitoring a state of said predetermined treatment process based on said calculated variation quantities of the processing condition parameters.
 29. A method for monitoring a semiconductor device manufacturing process according to claim 27, the method further comprising a step of obtaining corrections of the processing conditions of said predetermined treatment process by using information of the variation quantities of the processing condition parameters that were calculated at a step in which the variation quantities of said processing condition parameters were calculated.
 30. A method for monitoring a semiconductor device manufacturing process according to claim 27, the method further comprising a step of displaying information concerning said obtained corrections of the processing conditions of said predetermined treatment process.
 31. A method for monitoring a semiconductor device manufacturing process according to claim 27, the method further comprising a step of displaying time fluctuation of the feature quantities of the electron beam image of said pattern.
 32. A method for monitoring a semiconductor device manufacturing process according to claim 27, the method further comprising a step of displaying parameters indicating a state of said predetermined processing equipment that was obtained from said predetermined processing equipment together with time fluctuation of the feature quantities of the electron beam image of said pattern on said screen.
 33. A method for monitoring a semiconductor device manufacturing process according to claim 27, the method further comprising a step of correcting the processing conditions of said predetermined treatment process based on said obtained corrections of the processing conditions of said predetermined treatment process.
 34. A method for monitoring a semiconductor device manufacturing process according to claim 27, wherein said predetermined treatment process is either of an exposure process or an etching process.
 35. A method for monitoring a semiconductor device manufacturing process according to claim 27, wherein said feature quantities includes three kinds of feature quantifies of (a) a line width of the pattern, (b) a degree of rounding of a top part of the pattern, and (c) a degree of footing of a bottom part of the pattern.
 36. A method for monitoring a semiconductor device manufacturing process according to claim 27, wherein said feature quantities are feature quantities of a predicted cross section calculated from a line profile of said electron beam image.
 37. A method for monitoring a semiconductor device manufacturing process, the method comprising steps of: acquiring an electron beam image of a resist pattern produced on a substrate subject to processing by being subjected to an exposure process; calculating feature quantities of said resist pattern from said acquired electron beam image; acquiring an electron beam image of a circuit pattern that was produced by an etching process that uses the resist pattern formed by said exposure process as a mask; calculating feature quantities of said circuit pattern from said acquired electron beam image; and finding said etching conditions under which the feature quantities of said circuit pattern agree with the desired values by using information of (a) a relationship between said calculated feature quantities of said resist pattern and the exposure condition parameters in said exposure process and (b) a relationship among said exposure condition parameters, etching condition parameters in said etching process, and the feature quantities of said circuit pattern. 